Electroplate liquid for jointly plating through hole and blind hole and electroplating method

A technology of electroplating solution and plating solution, which is applied in the direction of electrical components, printed circuits, and printed circuit manufacturing, can solve the problems of increasing the labor load of workers analyzing potions, reducing reliability, and increasing process complexity, so as to improve the reliability of electroplating. high durability, short plating time, high ductility and thermal shock reliability

Inactive Publication Date: 2017-11-03
SUZHOU TIANCHENG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its advantage is that it can improve the production efficiency; it can also improve the elongation and ductility of electroplated copper, effectively improve the electroplating reliability of through holes and blind holes, and greatly reduce the technical problems of explosion, resistance increase or even failure; but The disadvantage is that the potion needs to be adjusted during the electroplating process, which increases the complexity of the process and increases the labor of workers analyzing the potion, thus reducing the reliability.

Method used

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  • Electroplate liquid for jointly plating through hole and blind hole and electroplating method
  • Electroplate liquid for jointly plating through hole and blind hole and electroplating method
  • Electroplate liquid for jointly plating through hole and blind hole and electroplating method

Examples

Experimental program
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Effect test

Embodiment 1

[0040] This example uses a vertical plating process. The composition of the through-blind hole co-plating electroplating solution of the present embodiment is as follows:

[0041] The A component is anhydrous copper sulfate whose mass concentration is 100g / L;

[0042] Described B component is the sulfuric acid that mass concentration is 200g / L;

[0043] Described C component is the chloride that mass concentration is 150mg / L;

[0044] The D component is a mixture of sodium polydithiodipropanesulfonate, sodium 3-mercaptopropanesulfonate, and sodium N,N-dimethyldithiocarbonylpropanesulfonate.

[0045] The mass ratio of the A component:B component:C component:D component is 100:200:0.15:0.003.

[0046] Metallize the substrate with through holes and blind holes, and immerse the metallized substrate in the co-plating electroplating solution for the above-mentioned through and blind holes for electroplating. The ductility and thermal shock reliability of the substrate after copp...

Embodiment 2

[0048] This example uses a vertical plating process. The composition of the through-blind hole co-plating electroplating solution of the present embodiment is as follows:

[0049] The A component is anhydrous copper sulfate whose mass concentration is 100g / L;

[0050] Described B component is the sulfuric acid that mass concentration is 200g / L;

[0051] Described C component is the chloride that mass concentration is 150mg / L;

[0052] The D component is a mixture of sodium polydithiodipropane sulfonate, sodium 3-mercaptopropane sulfonate, inner salt of isothiourea propane sulfonate and 3-(benzothiazole-2-mercapto)-propane sulfonate ;

[0053] The E component is a mixture of polyethylene glycol, polypropylene alcohol and fatty amine polyoxyethylene ether.

[0054] The mass ratio of component A: component B: component C: component D: component E is 100:200:0.15:0.003:10.

[0055] The electroplating method to the substrate is the same as in Example 1. The ductility and ther...

Embodiment 3

[0057] This example uses a vertical plating process. The composition of the through-blind hole co-plating electroplating solution of the present embodiment is as follows:

[0058] The A component is anhydrous copper sulfate whose mass concentration is 100g / L;

[0059] Described B component is the sulfuric acid that mass concentration is 200g / L;

[0060] Described C component is the chloride that mass concentration is 150mg / L;

[0061] The D component is a mixture of sodium polydithiodipropanesulfonate and 3-mercaptopropanesulfonate;

[0062] The E component is fatty amine polyoxyethylene ether;

[0063] The F component is a mixture of polyethyleneimine, basic yellow and polyamine salt.

[0064] The mass ratio of component A: component B: component C: component D: component E: component F is 100:200:0.15:0.003:10:0.002.

[0065] The electroplating method to the substrate is the same as in Example 1. The ductility and thermal shock reliability of the substrate after copper...

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Abstract

The invention provides a co-plating electroplating solution and an electroplating method for through-blind holes. In the through-blind hole co-plating electroplating solution of the present invention, the electroplating solution comprises A-D components, wherein the A component is anhydrous copper sulfate; the B component is sulfuric acid; the C component is chlorine compound; the D component is selected from sodium polydithiodipropanesulfonate, sodium 3-mercaptopropanesulfonate, sodium N,N-dimethyldithiocarbonylpropanesulfonate, internal salt of isothioureapropanesulfonate and 3-(benzothiazole-2-mercapto)-sodium propanesulfonate or a mixture of at least two of them. The total organic carbon content of the through-blind hole co-plating electroplating solution of the present invention is low, the ductility and thermal shock reliability of electroplated copper are high, the electroplating time is short, the process is simple, the electroplating efficiency is high, and the through hole and blind hole are effectively improved. plating reliability.

Description

technical field [0001] The invention belongs to the technical field of copper electroplating, and relates to a co-plating electroplating solution and an electroplating method for through-blind holes. Background technique [0002] The rapid development of electronic products has also promoted the technical development of printed circuit boards (PCBs). PCBs are the substrates that connect various electronic components. Metallized vias enable interconnection. Among them, through-hole electroplating and blind-hole electroplating processes appeared during copper electroplating of PCB. High-acid and low-copper plating is required for through-hole plating, and high-copper and low-acid plating is required for blind hole plating. Achieve through-blind co-plating technology. The special process includes the process of laser drilling-blind hole electroplating-mechanical drilled through hole-plated through hole, but this special process increases the difficulty of production, and it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/423
Inventor 王亚君刘江波童茂军
Owner SUZHOU TIANCHENG CHEM
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