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Multi-stage nickel plating process

A multi-stage, multi-stage technology, applied in the field of step-by-step electroplating parameter control, can solve problems such as high current, nickel layer burns, poor weldability, etc.

Active Publication Date: 2020-10-27
翔声科技(厦门)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing electroplating process, due to the large current in the nickel plating process, the tip discharge effect is prone to occur, causing burns on the nickel layer
After tin plating, the burnt position of the nickel layer cannot hang on the tin layer, which is likely to cause poor solderability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0041] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, temperature is 55℃, eccentric drum The speed is 14.5 rpm;

[0042] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0043] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and the...

Embodiment 2

[0048] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0049] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 100g / L, nickel bromide 7g / L and boric acid 50g / L; pH is 4.4, temperature is 55℃, eccentric drum The speed is 14.5 rpm;

[0050] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0051] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and the...

Embodiment 3

[0056] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0057] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, temperature is 55℃, eccentric drum The speed is 16.5 rev / min;

[0058] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0059] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and...

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Abstract

The invention provides a multi-stage nickel plating process, and relates to the technical field of electroplating. An electroplating solution of the nickel plating process comprises nickel sulfamate,nickel bromide and boric acid. The electroplating process comprises the following stages of a pre-plating stage, a the first stage, a second stage, a third stage and a fourth stage; in the pre-platingstage, the current density is 0.1 ASD-0.2 ASD, the pre-plating time is 240 seconds-360 seconds; in the first stage, the current density is 0.4 ASD-0.7 ASD, the electroplating time is 840 seconds-960seconds; in the second stage, the current density is 0.5 ASD-0.8 ASD, the electroplating time is 4000 seconds-4600 seconds; in the third stage, the current density is 0.4 ASD-0.6 ASD, the electroplating time is 3200 seconds-3800 seconds; and in the fourth stage, the current density is 0.2ASD-0.4 ASD; and the electroplating time is 1200 seconds-2200 seconds. According to the multi-stage nickel plating process, a staged electroplating mode is set, so that a plating layer is prevented from being damaged by instantaneous current; and in the last two electroplating stages, correcting is carried outon crystals on the surface of the plating layer, so that burns on the surface of the plating layer are eradicated, and the welding performance is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, and in particular to a method for controlling electroplating parameters by steps. Background technique [0002] Electroplating is the process of plating a layer of metal or alloy on the surface of some substrates by electrolysis, which is used to improve the wear resistance, conductivity, corrosion resistance and other properties of the substrate. Existing electronic components, such as filters, capacitors, circuit boards, etc., often require nickel-tin plating on the sputtering layer. After nickel plating, tin plating is performed. In the existing electroplating process, due to the large current in the nickel plating process, the tip discharge effect is prone to occur, causing burns on the nickel layer. After tin plating, the burnt position of the nickel layer cannot hang on the tin layer, which is likely to cause poor solderability. Contents of the invention [0003] The purpose of ...

Claims

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Application Information

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IPC IPC(8): C25D3/12C25D5/14C25D21/12
CPCC25D3/12C25D5/14C25D21/12
Inventor 王建国郝涛牛士瑞李宗超程东东杜河
Owner 翔声科技(厦门)有限公司
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