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A multi-stage nickel plating process

A multi-stage, multi-stage technology, applied in the field of step-by-step electroplating parameter control, can solve the problems of tip discharge effect, nickel layer burn, poor weldability, etc., and achieve the effect of promoting surface smoothness, short electroplating time and good welding performance.

Active Publication Date: 2022-02-11
翔声科技(厦门)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing electroplating process, due to the large current in the nickel plating process, the tip discharge effect is prone to occur, causing burns on the nickel layer
After tin plating, the burnt position of the nickel layer cannot hang on the tin layer, which is likely to cause poor solderability

Method used

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  • A multi-stage nickel plating process
  • A multi-stage nickel plating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0041] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, temperature is 55℃, eccentric drum The speed is 14.5 rpm;

[0042] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0043] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and the...

Embodiment 2

[0048] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0049] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 100g / L, nickel bromide 7g / L and boric acid 50g / L; pH is 4.4, temperature is 55℃, eccentric drum The speed is 14.5 rpm;

[0050] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0051] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and the...

Embodiment 3

[0056] A kind of multi-stage nickel plating process provided by the present embodiment includes the following stages:

[0057] Pre-plating stage: current density is 0.12ASD, pre-plating is 300s, electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, temperature is 55℃, eccentric drum The speed is 16.5 rev / min;

[0058] The first stage: According to the rate of 0.02ASD per second, the current density is increased to 0.54ASD; electroplating for 900s, the electroplating solution is nickel sulfamate 80g / L, nickel bromide 16g / L and boric acid 35g / L; pH is 4.2, The temperature is 55°C, and the rotational speed of the eccentric drum is 16.5 rpm;

[0059] The second stage: According to the rate of 0.01ASD per second, the current density is increased to 0.6ASD, electroplating for 4200s, the electroplating solution is 80g / L of nickel sulfamate, 16g / L of nickel bromide and 35g / L of boric acid; the pH is 4.2, The temperature is 55°C, and...

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Abstract

The invention provides a multi-stage nickel plating process and relates to the technical field of electroplating. The electroplating solution of the nickel plating process includes nickel sulfamate, nickel bromide and boric acid. The electroplating process includes the following stages: pre-plating stage: current density is 0.1-0.2ASD, pre-plating time is 240-360s; first stage: current density is 0.4-0.7ASD; electroplating time is 840-960s; second stage: current The density is 0.5~0.8ASD, the plating time is 4000~4600s; the third stage: the current density is 0.4~0.6ASD; the plating time is 3200~3800s; the fourth stage: the current density is 0.2~0.4ASD; the plating time is 1200~ 2200s. By setting a staged electroplating method, the instantaneous current damage to the coating is avoided. In the last two electroplating stages, the crystallization of the coating surface is corrected to prevent burns on the coating surface and significantly improve the welding performance.

Description

technical field [0001] The invention relates to the technical field of electroplating, and in particular to a method for controlling electroplating parameters by steps. Background technique [0002] Electroplating is the process of plating a layer of metal or alloy on the surface of some substrates by electrolysis, which is used to improve the wear resistance, conductivity, corrosion resistance and other properties of the substrate. Existing electronic components, such as filters, capacitors, circuit boards, etc., often require nickel-tin plating on the sputtering layer. After nickel plating, tin plating is performed. In the existing electroplating process, due to the large current in the nickel plating process, the tip discharge effect is prone to occur, causing burns on the nickel layer. After tin plating, the burnt position of the nickel layer cannot hang on the tin layer, which is likely to cause poor solderability. Contents of the invention [0003] The purpose of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D5/14C25D21/12
CPCC25D3/12C25D5/14C25D21/12
Inventor 王建国郝涛牛士瑞李宗超程东东杜河
Owner 翔声科技(厦门)有限公司
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