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A Multilayer Nickel Electroplating Additive with Improved Stability

An electroplating additive and multi-layer nickel technology, which is applied in the field of electroplating industry, can solve problems such as cumbersome process and insufficient stability of electroplating solution, and achieve the effects of good brightness, low current density, and reduced energy consumption

Active Publication Date: 2020-01-14
广州睿邦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the sulfur content of each layer of coating needs to be strictly controlled to adjust the potential difference, the multi-layer electroplating process requires the use of electroplating solutions containing different additives, the process is cumbersome, and the stability of the electroplating solution is insufficient

Method used

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  • A Multilayer Nickel Electroplating Additive with Improved Stability
  • A Multilayer Nickel Electroplating Additive with Improved Stability
  • A Multilayer Nickel Electroplating Additive with Improved Stability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041]Embodiment 1 provides a kind of multilayer nickel electroplating additive that improves stability, in terms of the concentration in the plating solution, its preparation raw material comprises:

[0042]

[0043] The raw materials for the preparation of the vat opener include: 30 g / L of sulfosalicylic acid, 40 g / L of 1,4-butynediol, 50 g / L of chloral hydrate, and the solvent is deionized water.

[0044] The raw materials for the preparation of the microporous nickel additive include: polyetheramine T403 4g / L, polyetheramine T5000 2g / L, and the solvent is deionized water.

[0045] This example also provides a nickel plating process containing the above multilayer nickel plating additives:

[0046] Add the above-mentioned multi-layer nickel electroplating additive to the electroplating bath in an amount of 1.2mL / L. During nickel plating, the bath temperature is 58°C and the current density is 17mA / cm 2 , The plating time is 23 minutes.

Embodiment 2

[0048] Embodiment 2 provides a kind of multilayer nickel electroplating additive that improves stability, in terms of the concentration in the plating solution, its preparation raw material comprises:

[0049]

[0050] The raw materials for the preparation of the vat opener include: 30 g / L of sulfosalicylic acid, 40 g / L of 1,4-butynediol, 50 g / L of chloral hydrate, and the solvent is deionized water.

[0051] The raw materials for the preparation of the microporous nickel additive include: polyetheramine T403 4g / L, polyetheramine T5000 2g / L, and the solvent is deionized water.

[0052] This example also provides a nickel plating process containing the above multilayer nickel plating additives:

[0053] Add the above-mentioned multi-layer nickel electroplating additive to the electroplating bath in an amount of 1.2mL / L. During nickel plating, the bath temperature is 56°C and the current density is 16mA / cm 2 , plating time is 20 minutes.

Embodiment 3

[0055] Embodiment 3 provides a kind of multilayer nickel electroplating additive that improves stability, in terms of the concentration in the plating solution, its preparation raw material comprises:

[0056]

[0057] The raw materials for the preparation of the vat opener include: 30 g / L of sulfosalicylic acid, 40 g / L of 1,4-butynediol, 50 g / L of chloral hydrate, and the solvent is deionized water.

[0058] The raw materials for the preparation of the microporous nickel additive include: polyetheramine T403 4g / L, polyetheramine T5000 2g / L, and the solvent is deionized water.

[0059] This example also provides a nickel plating process containing the above multilayer nickel plating additives:

[0060] Add the above-mentioned multi-layer nickel electroplating additive to the electroplating bath in an amount of 1.2mL / L. During nickel plating, the bath temperature is 58°C and the current density is 17mA / cm 2 , The plating time is 23 minutes.

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Abstract

The invention discloses a multi-layer nickel electroplating additive for improving stability. The multi-layer nickel electroplating additive is prepared from raw materials of 2-15 mL / L of a cylinder opening agent, 1-10 mL / L of a microporous nickel additive and 1-2 mL / L of a wetting agent according to the concentration in a plating solution. The invention further discloses a nickel plating processcontaining the multi-layer nickel electroplating additive. The multi-layer nickel electroplating additive is added into the electroplating solution at the addition volume of 1-1.4 mL / L, and during nickel plating, the temperature of the plating solution is 50-60 DEG C, the current density is 16-19 mA / cm<2>, and the electroplating time is 18-25 min.

Description

technical field [0001] The invention relates to the field of electroplating industry, in particular to a multilayer nickel electroplating additive with improved stability. Background technique [0002] The electroplating process is a method of plating a layer of metal on a conductor using the principle of electrolysis. During electroplating, the plated metal or other insoluble materials are used as the anode, and the workpiece to be plated is used as the cathode. The cations of the plated metal are reduced to a coating on the surface of the cathode. Electroplating can improve the corrosion resistance, strength, hardness, wear resistance, electrical conductivity, heat resistance and other properties of the cathode, and can also beautify the surface decoratively. The multi-layer electroplating process is the electroplating process of several layers of different materials on the same electroplating processed product. Studies have shown that multi-layer electroplating can not on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/16C25D3/18C25D5/14
CPCC25D3/16C25D3/18C25D5/14
Inventor 施佳抄
Owner 广州睿邦新材料科技有限公司
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