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A kind of nickel plating solution applied to printed circuit board and electroplating nickel method thereof

A printed circuit board, electroplating nickel technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of electroplating cannot be carried out normally, the plating layer has no bonding force with the substrate, and the stability of the electroplating nickel solution is poor, so as to achieve good Colloidal properties and dispersing effects, accelerating the activation reaction speed, and avoiding the effect of metal ion deposition

Active Publication Date: 2022-02-08
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After long-term use in the market, the existing electroplating nickel still has the following defects: 1) The electroplating temperature is too high, usually between 75°C and 85°C, which can easily lead to excessive crystallinity and rigidity of the produced plated parts, making The roughened surface becomes brittle, resulting in almost no bonding force between the coating and the substrate, and the coating is easily peeled off under high temperature cycle conditions.
2) Since the current electroplating time in the nickel industry is between 30-50 minutes, the stability of the electroplating nickel solution is getting worse and worse with the extension of the electroplating time, which will greatly affect the discharge deposition effect of metal nickel ions, resulting in abnormal electroplating. carry out, and finally affect the quality of the coating

Method used

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  • A kind of nickel plating solution applied to printed circuit board and electroplating nickel method thereof
  • A kind of nickel plating solution applied to printed circuit board and electroplating nickel method thereof
  • A kind of nickel plating solution applied to printed circuit board and electroplating nickel method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0063]

[0064]The composite complexing agent includes A component and B component, and the A component and the B component are 3:1 according to the mass concentration ratio; the A component includes citric acid whose mass concentration is 2g / L, 1g / L of ammonium acetate, 2.25g / L of malic acid; component B is a mixture of polyacrylamide, aminocarboxylic acid resin, hyperbranched polyurethane sulfonate, β-nicotinamide adenine dinucleotide, mass concentration It is 1.75g / L. The nickel plating solution can be formed by adjusting the pH value of the solution to 4.5 and buffering with a pH buffer agent with a mass concentration of 25%.

[0065] Using the nickel plating solution prepared by this component, the printed circuit board is electroplated by this nickel electroplating method, the temperature of the first stage is 70°C, and the de...

Embodiment 2

[0070] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0071]

[0072] The composite complexing agent includes A component and B component, and the A component and the B component are in a mass concentration ratio of 3:2; the A component includes citric acid with a mass concentration of 1g / L, 1g / L of ammonium acetate, 1g / L of malic acid; the mass concentration of component B is 2g / L. The nickel plating solution can be formed after the pH value of the solution is adjusted to 4.6 with a pH buffer agent with a mass concentration of 25%.

[0073] Using the nickel plating solution prepared by this component, the printed circuit board is electroplated by this nickel electroplating method. The first stage temperature is 60°C, the time is 10 minutes, and the density is 2A / dm 2 , the thickness of the nickel layer obtained in the first stage is 4 microns, and the entire electroplating process tak...

Embodiment 3

[0078] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0079]

[0080] The composite complexing agent includes A component and B component, and the A component and the B component are 3:2 according to the mass concentration ratio; the A component includes citric acid whose mass concentration is 4g / L, 2g / L of ammonium acetate, 3g / L of malic acid; the mass concentration of component B is 6g / L. The nickel plating solution can be formed after the pH value of the solution is adjusted to 4.6 with a pH buffer agent with a mass concentration of 25%.

[0081] Using the nickel plating solution prepared by this component, the printed circuit board is electroplated by this nickel electroplating method. The temperature of the first stage is 65 ° C, the time is 5 minutes, and the density is 2A / dm 2 , the thickness of the nickel layer obtained in the first stage is 4 microns; the temperature of the se...

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Abstract

The invention discloses a nickel plating solution applied to printed circuit boards and a nickel electroplating method thereof, comprising components with the following mass concentrations: nickel salt 35-50g / L; conductive salt 20-40g / L; anti-aging agent 10 ‑15g / L; composite complexing agent 5‑15g / L; reaction accelerator 50‑80mg / L; stress reliever 50‑80mg / L; surfactant 5‑10mg / L; composite stabilizer 0.2‑5mg / L ; The composite complexing agent includes A component and B component, and the A component and the B component are 3:1-2 according to the mass concentration ratio; the A component includes a mass concentration of 1-5g / L citric acid, 1‑2g / L ammonium acetate, 1‑5g / L malic acid. The solution of the invention ensures the bond strength between the plating layer and the substrate, so that the nickel plating layer has good adhesion and uniformity of the plating layer; the process not only ensures the uniformity of electroplating, but also shortens the electroplating time.

Description

technical field [0001] The invention relates to the technical field of nickel electroplating, in particular to a nickel plating solution applied to printed circuit boards and a nickel electroplating method thereof. Background technique [0002] Printed circuit board (PCB circuit board), also known as printed circuit board, is the provider of electrical connections for electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products. [0003] The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliabili...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D7/00H05K3/18
CPCC25D3/12C25D7/00H05K3/188
Inventor 洪学平姚吉豪
Owner SHENZHEN CHENGGONG CHEM
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