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Nickel plating solution applied to printed circuit board and nickel electroplating method thereof

A technology for printed circuit boards and nickel electroplating, which is used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems that electroplating cannot be carried out normally, the stability of electroplating nickel solution is poor, and the coating layer has no bonding force with the substrate. Colloidal properties and dispersion, avoid metal ion deposition, accelerate the effect of activation reaction

Active Publication Date: 2021-12-14
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nickel salt 35-50g / L

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0076] Nickel sulfate 35g / L

[0077] Conductive salt 4 0g / L

[0078] Anti-aging agent AW 10 g / L

[0079] Compound complexing agent 7g / L

[0080] Reaction Accelerator 80mg / L

[0081] Stress reliever 80mg / L

[0082] Sodium methallyl sulfonate 10mg / L

[0083] Compound stabilizer 3mg / L

[0084] The composite complexing agent includes A component and B component, and the A component and B component are in a mass concentration ratio of 3:1; the A component includes citric acid with a mass concentration of 2g / L, 1g / L of ammonium acetate, 2.25g / L of malic acid; component B is a mixture of polyacrylamide, aminocarboxylic acid resin, hyperbranched polyurethane sulfonate, β-nicotinamide adenine dinucleotide, mass concentration It is 1.75g / L. The nickel plating solution can be formed by adjusting the pH value of the solution to 4.5 and buff...

Embodiment 2

[0090] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0091] Nickel sulfamate 50 g / L

[0092] Conductive salt 20g / L

[0093] Anti-aging agent AW 15g / L

[0094] Compound complexing agent 5g / L

[0095] Reaction Accelerator 75mg / L

[0096] Stress reliever 75mg / L

[0097] Sodium methallyl sulfonate 5mg / L

[0098] Compound stabilizer 0.2mg / L

[0099] The composite complexing agent includes A component and B component, and the A component and B component are in a mass concentration ratio of 3:2; the A component includes citric acid with a mass concentration of 1g / L, 1g / L of ammonium acetate, 1g / L of malic acid; the mass concentration of component B is 2g / L. The nickel plating solution can be formed after adjusting the pH value of the solution to 4.6 with a pH buffer agent with a mass concentration of 25%.

[0100] Using the nickel plating solution prepared by this component, the printed ...

Embodiment 3

[0105] A kind of nickel plating solution that is applied to printed circuit board, comprises the component of following mass concentration:

[0106] Nickel sulfate 40 g / L

[0107] Conductive salt WA 40g / L

[0108] Anti-aging agent 12g / L

[0109] Compound complexing agent 15g / L

[0110] Reaction Accelerator 70mg / L

[0111] Stress reliever 70mg / L

[0112] Sodium methallyl sulfonate 10mg / L

[0113] Compound stabilizer 5mg / L

[0114] The composite complexing agent includes A component and B component, and the A component and B component are in a mass concentration ratio of 3:2; the A component includes citric acid with a mass concentration of 4g / L, 2g / L of ammonium acetate, 3g / L of malic acid; the mass concentration of component B is 6g / L. The nickel plating solution can be formed after adjusting the pH value of the solution to 4.6 with a pH buffer agent with a mass concentration of 25%.

[0115] Using the nickel plating solution prepared by this component, the printed ci...

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Abstract

The invention discloses a nickel plating solution applied to a printed circuit board and a nickel electroplating method thereof. The nickel plating solution comprises the following components including, by mass concentration, 35-50 g / L of nickel salt, 20-40 g / L of conductive salt, 10-15 g / L of an anti-aging agent, 5-15 g / L of a composite complexing agent, 50-80 mg / L of a reaction accelerator, 50-80 mg / L of a stress relieving agent, 5-10 mg / L of a surfactant, and 0.2-5 mg / L of a compound stabilizer. The composite complexing agent comprises a component A and a component B, wherein the mass concentration ratio of the component A to the component B is 3: (1-2). The component A comprises, by mass concentration, 1-5 g / L of citric acid, 1-2 g / L of ammonium acetate, and 1-5 g / L of malic acid. According to the solution, the binding force strength between a plating layer and a base body is guaranteed, so that a nickel plating layer has good adhesiveness, and the plating layer is uniform. According to the process, the electroplating uniformity is guaranteed, and the electroplating time is shorter.

Description

technical field [0001] The invention relates to the technical field of nickel electroplating, in particular to a nickel plating solution applied to printed circuit boards and a nickel electroplating method thereof. Background technique [0002] Printed circuit board (PCB circuit board), also known as printed circuit board, is the provider of electrical connections for electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products. The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D7/00H05K3/18
CPCC25D3/12C25D7/00H05K3/188
Inventor 洪学平姚吉豪
Owner SHENZHEN CHENGGONG CHEM
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