Nickel plating solution applied to printed circuit board and nickel electroplating method thereof

Abstract

The invention discloses a nickel plating solution applied to a printed circuit board and a nickel electroplating method thereof. The nickel plating solution comprises the following components including, by mass concentration, 35-50 g / L of nickel salt, 20-40 g / L of conductive salt, 10-15 g / L of an anti-aging agent, 5-15 g / L of a composite complexing agent, 50-80 mg / L of a reaction accelerator, 50-80 mg / L of a stress relieving agent, 5-10 mg / L of a surfactant, and 0.2-5 mg / L of a compound stabilizer. The composite complexing agent comprises a component A and a component B, wherein the mass concentration ratio of the component A to the component B is 3: (1-2). The component A comprises, by mass concentration, 1-5 g / L of citric acid, 1-2 g / L of ammonium acetate, and 1-5 g / L of malic acid. According to the solution, the binding force strength between a plating layer and a base body is guaranteed, so that a nickel plating layer has good adhesiveness, and the plating layer is uniform. According to the process, the electroplating uniformity is guaranteed, and the electroplating time is shorter.

Description

technical field

[0001] The invention relates to the technical field of nickel electroplating, in particular to a nickel plating solution applied to printed circuit boards and a nickel electroplating method thereof. Background technique

[0002] Printed circuit board (PCB circuit board), also known as printed circuit board, is the provider of electrical connections for electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products. The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi...