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A planar power module

A power module and planar technology, which is applied in the field of planar power modules, can solve the problems of large parasitic inductance of power modules, affecting device switching performance, etc., achieve reliable performance and avoid long-term reliability failures

Active Publication Date: 2019-10-18
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, due to the existence of a large number of bonding wires 104, a large parasitic inductance will be generated inside the power module, thereby affecting the switching performance of the device.

Method used

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  • A planar power module
  • A planar power module
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Embodiment Construction

[0037] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and examples, so as to fully understand and implement the process of how to apply technical means to solve technical problems and achieve technical effects in the present invention. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0038] Also, in the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without the specific details or in the particular manner described.

[0039] figure 2 A schematic structural diagram of...

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Abstract

The invention discloses a planar power module. The planar power module comprises: a first liner; a chip welded on a corresponding position of the first liner; a metal pad and a first circuit layer, the chip and / or The first backing board is connected with the corresponding port of the first circuit layer through the metal gasket; the power terminal and the control terminal connected with the first backing board; and the packaging shell. The power module avoids the problem of long-term reliability failure of the power module caused by a large number of bonding wires falling off or root breakage, and at the same time avoids the problem of large parasitic inductance inside the power module due to the use of a large number of bonding wires, thus ensuring The performance of the module is reliable.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a planar power module. Background technique [0002] The power electronic module represented by IGBT is one of the core components of motor drive and control in electric vehicles. As people's performance requirements for automotive motor inverters are getting higher and higher, higher requirements are also put forward for power electronic modules in terms of power density, operating temperature, efficient heat dissipation, and power conversion efficiency. [0003] figure 1 A schematic structural diagram of a conventional power module is shown. [0004] Such as figure 1 As shown, the traditional power module packaging usually solders the semiconductor chip 101 to the insulating substrate 103 through the brazing layer 102, and uses the bonding wire 104 on the upper surface of the semiconductor chip 101 to realize electrical connections for different purposes through wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49
CPCH01L24/42H01L2924/13055H01L2924/13091H01L2224/33H01L2224/48137H01L2924/00
Inventor 吴义伯王彦刚马雅青李云戴小平刘国友
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD