Power module for electric automobile
A technology for power modules and electric vehicles, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of large internal thermal resistance, difficult to meet the needs of heat dissipation, low efficiency, etc., to achieve reliable performance and avoid long-term reliability. Ineffective effect
Active Publication Date: 2015-12-16
ZHUZHOU CRRC TIMES SEMICON CO LTD
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Problems solved by technology
The heat dissipation efficiency of this structure is relatively low, and the internal thermal resistance is also large.
For inverters for electric vehicles with very strict heat dissipation requirements, this heat dissipation method is already difficult to meet the needs
Method used
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[0038] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and examples, so as to fully understand and implement the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects. It should be noted that, as long as there is no conflict, each embodiment of the present invention and each feature of each embodiment can be combined with each other, and the formed technical solutions all fall within the protection scope of the present invention.
[0039] Meanwhile, in the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present invention. It will be apparent, however, to those skilled in the art that the present invention may be practiced without the specific details or in the specific manner described herein.
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The invention discloses a power module for electric automobile. The power module comprises semiconductor chips, a first heat conducting plate, a welding layer, a second heat conducting plate, a metal solder ball array, a power terminal, a control terminal and a packaging shell, wherein the first heat conducting plate is connected to corresponding ports at the first surfaces of the semiconductor chips via the welding layer, the second heat conducting plate is connected to corresponding ports at the second surfaces of the semiconductor chips via the welding metal solder ball array, and the power terminal and the control terminal are connected with the first heat conducting plate. The power module can solve the problems in internal parasitic capacity and heat radiation efficiency of the power module via solder ball interconnection and double-side heat radiation, and thus, the reliable performance of the power module is ensured.
Description
technical field [0001] The present invention relates to the technical field of power electronics, in particular to a power module for electric vehicles. Background technique [0002] The exploration of energy saving and environmental protection has become the theme of today's industrial development. Electric vehicles have developed vigorously in recent years, and power electronic devices have become a hot spot in the field of electric vehicles. Insulated Gate Bipolar Transistor (IGBT) modules combine the advantages of bipolar transistors (BJTs) and MOSFETs, showing excellent performance, and thus are widely used in motor drive and control systems in electric vehicles. [0003] With the increasing demand for the performance of automotive motor inverters, higher requirements are also placed on power electronic modules in terms of operating temperature and efficient heat dissipation. Under the vehicle cooling water cycle, the changing ambient temperature is the cause of the pa...
Claims
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IPC IPC(8): H01L23/31H01L23/36
CPCH01L2924/13055H01L2924/13091H01L2224/32225H01L2224/48091H01L2224/48139H01L2224/48227H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
Inventor 马雅青吴义伯王彦刚李云余军戴小平刘国友
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD