Semiconductor device lead shaping device
A shaping device and semiconductor technology, applied in the field of semiconductor pin shaping devices, can solve the problems of abnormal use of semiconductors, high production costs, low work efficiency, etc., and achieve the effects of correcting deformation, improving deformation, and reducing labor.
Active Publication Date: 2017-06-16
江阴亨德拉科技有限公司
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] Commonly used semiconductors will have pin deformation during the production process. Such semiconductors cannot be used normally and need to be corrected manually, which leads to high production costs and low work efficiency.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] The present invention will be further described below in conjunction with specific drawings.
[0016] Such as Figure 1 to Figure 5 As shown: the semiconductor device pin shaping device includes a base plate 1, a first shaping cylinder seat 2-1, a second shaping cylinder seat 2-2, a first shaping cylinder 3-1, a second shaping cylinder 3-2, a second shaping cylinder A shaping connecting piece 4, a second shaping connecting piece 5, a first shaping piece 6, a first shaping cover plate 7, a shaping seat 8, a first positioning piece 9, a second positioning piece 10, a first positioning connecting piece 11, a first positioning piece Two positioning connectors 12, the first positioning cylinder seat 13-1, the second positioning cylinder seat 13-2, the first positioning cylinder 14-1, the second positioning cylinder 14-2, the second shaping part 15, and the second shaping cover Plate 16, third positioning piece 17, fourth positioning piece 18, third shaping connecting piece ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a semi-conductor apparatus pin shaping device. The semi-conductor apparatus pin shaping device comprises a baseplate and is characterized in that a shaping device and a positioning device are arranged on the baseplate; the shaping device comprises a first shaping cylinder seat and a second shaping cylinder seat which are symmetrically mounted at two ends of the baseplate; a first shaping cylinder is mounted on the first shaping cylinder seat; a piston rod of the first shaping cylinder is connected with a first shaping connecting part connected with a second shaping connecting part; the second shaping connecting part is connected with a first shaping part; a second shaping cylinder is mounted on the second shaping cylinder seat; a piston rod of the second shaping cylinder is connected with a third shaping connecting part connected with a fourth shaping connecting part; the fourth shaping connecting part is connected with a second shaping part; a shaping seat is arranged between the second shaping seat and the baseplate. Through adoption of the semi-conductor apparatus pin shaping device, a deformed guiding pin of a semi-conductor can be corrected, so that the guiding pin can be used normally, and manual operation is avoided.
Description
technical field [0001] The invention relates to a semiconductor device lead shaping device, which belongs to the technical field of semiconductor lead shaping devices. Background technique [0002] Commonly used semiconductors have pin deformations during the production process, such semiconductors cannot be used normally and need to be corrected manually, which leads to high production costs and low work efficiency. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a semiconductor device pin shaping device, which can correct the deformation of the semiconductor pointing pin, so that it can be used normally without manual operation. [0004] According to the technical solution provided by the present invention, the semiconductor device pin shaping device includes a bottom plate, which is characterized in that: a shaping device and a positioning device are installed on the bottom plate; The...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B21F1/02
CPCB21F1/02
Inventor 陈伟徐勇叶建国韩宙程华胜魏春阳
Owner 江阴亨德拉科技有限公司