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Resistor printing method

A printing method and resistor technology, applied in the field of resistor printing, can solve the problems of high cost, poor market adaptability, and unsuitability for mass production, and achieve the effect of low cost and strong market adaptability

Inactive Publication Date: 2015-12-30
SHANGHAI KEMIN ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Resistor printing technology is very common, but the uniformity (linearity) of resistance distribution is the bottleneck of the current industry. At present, most domestic companies use post-repair engraving to adjust resistance, resulting in high cost, not suitable for mass production, and poor market adaptability.

Method used

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  • Resistor printing method

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Embodiment Construction

[0007] The preferred embodiments of the present invention are given below in conjunction with the accompanying drawings to describe the technical solution of the present invention in detail.

[0008] Such as figure 1 As shown, the resistance printing method of the present invention adopts the first silver paste area 1, the second silver paste area 2, and the first silver paste area 3, and the second silver paste area 2 is located at the first silver paste area 1 and the first silver paste area 3 Between, the first silver paste area 1 is provided with the first through hole 4, the second silver paste area 2 is provided with the second through hole 5, and the first silver paste area 3 is provided with the third through hole 6; The thickness of the silver paste area 1, the thickness of the second silver paste area 2, and the thickness of the first silver paste area 3 are all 0.08mm-0.1mm, which is 0.085mm lower than the copper foil.

[0009] The invention adopts silver paste to ...

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Abstract

The invention discloses a resistor printing method which adopts a first silver paste area, a second silver paste area and another first silver paste area, wherein the second silver paste area is located between the first silver paste areas, a first through hole is formed in the first silver paste area, a second through hole is formed in the second silver paste area, and a third hole is formed in the other first silver paste area; the thickness of the first silver paste area, the second silver paste area and the other first silver paste area is 0.08 mm to 0.1 mm, and 0.085 mm of step height is reduced compared with a copper foil. According to the resistor printing method, the cost is low, the method is suitable for massive production, and the market adaptability is high.

Description

technical field [0001] The invention relates to a printing method, in particular to a resistance printing method. Background technique [0002] Resistor printing technology is very common, but the uniformity (linearity) of resistance distribution is the bottleneck of the current industry. At present, most domestic companies use post-repair engraving to adjust resistance, resulting in high cost, not suitable for mass production, and poor market adaptability. . Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a resistance printing method, which has low cost, is suitable for mass production, and has strong market adaptability. [0004] The present invention solves the above technical problems through the following technical solutions: a resistance printing method, which is characterized in that it uses the first silver paste area, the second silver paste area, the first silver paste area, the second silver paste are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M3/00C09D11/52
Inventor 陈昌健
Owner SHANGHAI KEMIN ELECTRONICS SCI & TECH CO LTD