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Package device batched power-on aging device

A technology for packaging devices and electrical aging, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of reduced work efficiency, limited quantity, large size and structure, etc., to improve work efficiency, reduce size and structure, The effect of reducing the cost of realization

Active Publication Date: 2015-12-30
安徽京芯传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The device adopting the above method has a large body and structure, and the number that can be placed in the oven (aging box) is limited, thus greatly reducing the work efficiency

Method used

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  • Package device batched power-on aging device
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  • Package device batched power-on aging device

Examples

Experimental program
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Embodiment Construction

[0016] Aiming at the problems existing in the prior art, the present invention proposes an improved batch power-on aging device for packaged devices, including: a base, a power-up aging PCB board, a limiting plate for packaged devices, and packaged devices that need power-up and aging and compression cover etc.

[0017] Wherein, the base is provided with a PCB board inlay groove, and the power-on aging PCB board is located in the PCB board inlay groove;

[0018] The limiting plate of the packaged device is located on the power-on aging PCB board;

[0019] The packaged devices are distributed and placed in the slots of the packaged device limiting plate, and are in contact with the raised packaged device energization aging contacts arranged on the energization aging PCB board;

[0020] The pressing cover plate is located on the packaging device and is used for pressing the packaging device.

[0021] Preferably, N first positioning columns are arranged in the embedded groove o...

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PUM

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Abstract

The invention discloses a package device batched power-on aging device. The package device batched power-on aging device comprises a base, a power-on aging PCB, a package device limiting plate, package devices needing to conduct power-on aging and a pressing cover plate; a PCB inlay groove is formed in the base, and the power-on aging PCB is located in the PCB inlay groove; the package device limiting plate is located above the power-on aging PBC; the package devices are arranged in clamping grooves of the package device limiting plate in a distributed mode and make contact with protruding package device power-on aging contacts arranged on the power-on aging PCB; the pressing cover plate is located above the package devices and used for tightly pressing the package devices. According to the package device batched power-on aging device, the working efficiency can be effectively improved.

Description

technical field [0001] The invention relates to a power-on aging technology for packaged devices, in particular to a batch power-on aging device for packaged devices. Background technique [0002] The traditional batch power-on aging device for packaged devices generally uses the test socket corresponding to the packaged device to be welded on the printed circuit board (PCB, Printed Circuit Board) with wiring, and then the packaged device is placed on the test socket for power-on. way of aging. [0003] The device adopting the above method has a large body and structure, and the number that can be placed in the oven (aging box) is limited, thereby greatly reducing the work efficiency. Contents of the invention [0004] In view of this, the present invention provides a batch power-on aging device for packaged devices, which can effectively improve work efficiency. [0005] In order to achieve the above object, the technical solution of the present invention is achieved in...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67011
Inventor 张献金王维绪孙永安周刚
Owner 安徽京芯传感科技有限公司