a circuit board

Abstract

The invention discloses a circuit board, which comprises circuit traces, bonding pads and electronic elements, which are arranged on a substrate, wherein the bonding pads comprises element bonding pads and auxiliary bonding pads, which are arranged in an insulating manner at intervals; the element bonding pads and the circuit traces are arranged in the insulating manner and are used for connecting the electronic elements in a welding manner; and the auxiliary bonding pads are electrically connected with the circuit traces and are used for connecting the element bonding pads in the welding manner. According to the technical scheme disclosed by the embodiment of the invention, the electronic elements on the circuit substrate are not dismantled; a detection function on the electronic elements can be achieved only by breaking soldering tin in gaps between the discrete bonding pads; the probability that the bonding pads fall off due to collision is reduced; ageing and dropping of the bonding pads, which can be caused by long-term ironing in a welding process are remedied to a certain extent.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of electronic circuits, and in particular, to a circuit board. Background technique [0002] The basic structure of the circuit board generally includes circuit traces and electronic components arranged on the substrate, and the electronic components are fixed on the circuit board by pad welding and electrically connected with the circuit traces. [0003] Pads are copper foils used for welding electronic components or circuit traces on circuit boards. They are generally arranged at the ends of circuit traces. The pins of electronic components are soldered to the pads by soldering to connect with circuit traces. [0004] The current method for realizing circuit disconnection is to use soldering iron, heat gun and other welding tools to disassemble the electronic components from the circuit. After completing the electrical function test or problem repair, solder some of the removed elect...

AI Technical Summary

Problems solved by technology

During this process, the steps to disassemble electronic components are very cumbersome. Large electronic components and chips are usually inconvenient to disassemble and weld. Especially when repairing circuits, many electronic components may have to be repaired separately, which requires a lot of work and needs to be very delicate.

When disassembling multiple electronic components at one time, it is easy to confuse and lose electronic components. Too frequent desoldering of electronic components on the circuit board may cause damage to the pads, or even irreversible damage.

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