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Processing method of step groove circuit board and step groove circuit board

A processing method and stepped groove technology are applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc. to achieve the effect of solving the connection between layers of stepped groove circuit boards

Active Publication Date: 2018-08-07
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a method for processing a stepped groove circuit board and a stepped groove circuit board to solve the technical problem that blind holes cannot be used to connect layers of stepped groove circuit boards in the prior art

Method used

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  • Processing method of step groove circuit board and step groove circuit board
  • Processing method of step groove circuit board and step groove circuit board
  • Processing method of step groove circuit board and step groove circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Please refer to figure 1 , an embodiment of the present invention provides a processing method for a stepped groove circuit board, which may include:

[0032] 110. On the first side of the first laminate, the metal layer in the stepped groove area is processed into a stepped groove circuit pattern, and all the metal layers in the non-step groove area are removed to reveal the insulating substrate, and the insulating substrate will be exposed. The non-step groove area is thickened.

[0033] In the embodiment of the present invention, for the step-slot circuit board to be processed, the step-slot circuit board is divided into two parts with the bottom plane of the step-slot as the interface, and the step-slot circuit board is manufactured separately. Each of these parts is pre-pressed into laminates, referred to as the first laminate and the second laminate, respectively. Wherein, each laminate includes: metal layers on two sides, at least one circuit layer in the middl...

Embodiment 2

[0055] Please refer to image 3 , Another method for processing a stepped groove circuit board according to an embodiment of the present invention may include:

[0056] 310. On the first side of the first laminate, the metal layer in the stepped groove area is processed into a stepped groove circuit pattern, and all the metal layers in the non-step groove area are removed to reveal the insulating substrate, and the insulating substrate will be exposed. The non-step groove area is thickened.

[0057] 320. Process through holes in the non-step groove regions of the second laminate, and metalize the through holes.

[0058] 330. On the first side of the second laminate, process the metal layer in the non-step groove area into a non-step groove circuit pattern, remove all the metal layers in the step groove area to reveal the insulating base material, and expose the insulating base A groove is formed in the stepped groove area of ​​the material, wherein the non-step groove circui...

Embodiment 3

[0065] Please refer to Figure 2m , an embodiment of the present invention provides a stepped groove circuit board, one side of the stepped groove circuit board has a stepped groove 250, the bottom of the stepped groove 250 has a stepped groove circuit pattern 2101, and the inner wall of the stepped groove 250 has a metal Chemical plating layer, the non-step groove circuit pattern 2204 located on the same layer as the step groove circuit pattern 2101 passes through the metallized coating on the inner wall of the step groove 250, and the outer layer circuit with the step groove side of the step groove circuit board Graphical connection.

[0066] As can be seen from the above, the present invention discloses a step-slot circuit board, the step-slot circuit board is connected between layers through the metallized inner wall of the step-slot, so no metallized blind holes need to be processed, which solves the problem that blind holes cannot be used in the prior art. The technical...

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Abstract

The invention discloses a processing method of a stepped groove circuit board, which aims to solve the technical problem in the prior art that blind holes cannot be used to connect layers of the stepped groove circuit board. The embodiment of the present invention also provides a corresponding stepped groove circuit board. The method may include: on the first surface of the first laminate, processing the metal layer in the stepped groove area into a stepped groove circuit pattern; processing at least one through groove in the stepped groove area of ​​the second laminate, and processing the metal layer of the through groove On the first side of the second laminate, the metal layer in the non-step groove area is processed into a non-step groove circuit pattern, and a groove is formed in the step groove area; the first laminate and the second laminate are laminated Integrate to form a multi-layer board, so that: the circuit pattern of the step groove and the circuit pattern of the non-step groove are located on the same layer in the multi-layer board; the stepped groove is formed by controlled depth milling, wherein the through A portion of the metallized sidewall of the groove becomes part of the inner wall of the stepped groove.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a processing method of a stepped groove circuit board and a stepped groove circuit board. Background technique [0002] At present, printed circuit boards (Printed Circuit Boards, PCBs) are more and more widely used. Embedding electronic components such as chips into the stepped grooves of the stepped groove circuit board can reduce the package volume of the circuit board and meet the needs of product miniaturization. [0003] In some stepped groove circuit boards, it is necessary to realize the connection between the layered circuit pattern on the bottom surface of the stepped groove and the circuit pattern on the surface of the circuit board. In the prior art, controlled depth drilling is usually used to process blind holes, and the blind holes are metallized, and the connection is realized by using the metallized blind holes. However, when the number of layers of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/46H05K1/11
Inventor 黄立球刘宝林沙雷
Owner SHENNAN CIRCUITS
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