Injection molding method of embedded hardened pc sheet and anti-scratch hardened electronic product window
A technology of electronic products and hard electronics, which is applied in the direction of chassis/cabinet/drawer parts, etc., can solve the problems of easy scratching, high defective products and high cost
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Embodiment 1
[0037] Example 1, see figure 1 , the injection molding method of the embedded stiffened PC sheet that the present embodiment provides, it comprises the following steps:
[0038] (1) Prepare a hardened PC sheet 1 consistent with the size of the window of the electronic product. One side of the hardened PC sheet 1 is a hardened surface 11, and the other side is a PC surface 12. The hardened surface 11 is provided with a color to distinguish On the PC side 12;
[0039] (2) prepare electronic product PC window injection mold, be provided with the groove that places the hardened PC sheet 1 described in step (1) in this mold cavity;
[0040] (3) The hardened PC sheet 1 described in step (1) is placed in the mold cavity, the hardened surface 11 of the hardened PC sheet 1 is placed downward, and the hardened surface 11 is in contact with the mold shape. Cavity bottom fit;
[0041] (4) Close the mold and inject PC material to form a double-layer structure of anti-scratch and hardene...
Embodiment 2
[0044] Example 2, see figure 2 The injection molding method of the embedded hard PC sheet provided by this embodiment is basically the same as that of embodiment 1, the difference is that it includes the following steps:
[0045] (1) Prepare a hardened PC sheet 1 consistent with the size of the window of the electronic product. One side of the hardened PC sheet 1 is a hardened surface 11, and the other side is a PC surface 12. The hardened surface 11 is provided with a color to distinguish On the PC side 12;
[0046] (11) A plurality of independent PC flakes 13 neatly arranged into a surface are set, and a buffer pad 14 is arranged at the bottom of the surface formed by the independent PC flakes 13, and the independent PC flakes 13 and buffer pad 14 of the plurality of sheets are arranged. Forming a layer of the hardened PC sheet 1;
[0047] The buffer pad 14 completely overlaps the surface formed by a plurality of independent PC flakes 13 neatly arranged;
[0048] (2) pre...
Embodiment 3
[0054] Example 3, see image 3 , the injection molding method of the embedded hardened PC sheet provided by this embodiment is basically the same as that of Embodiment 2, the difference is that it includes the following steps:
[0055] (1) Prepare a hardened PC sheet 1 consistent with the size of the window of the electronic product. One side of the hardened PC sheet 1 is a hardened surface 11, and the other side is a PC surface 12. The hardened surface 11 is provided with a color to distinguish On the PC side 12;
[0056] (11) A plurality of independent PC flakes 13 neatly arranged into a surface are set, and a buffer pad 14 is arranged at the bottom of the face formed by the independent PC flakes 13, and the independent PC flakes 13 and buffer pad 14 of the plurality of sheets are arranged. Forming a layer of the hardened PC sheet 1;
[0057] The buffer pad 14 completely overlaps the surface formed by a plurality of independent PC flakes 13 neatly arranged;
[0058] (12) ...
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Abstract
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