Cutting fluid dewatering structure for silicon wafer cutting machine
A cutting fluid and cutting machine technology, which is applied in the field of cutting fluid water removal structure for silicon wafer cutting machines, can solve the problems of low water removal efficiency, and achieve the effects of improving water removal efficiency, low temperature and energy saving.
Inactive Publication Date: 2017-02-01
ZHEJIANG HUIHONG SOLAR ENERGY CO LTD
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The invention provides a cutting fluid dewatering structure for a silicon wafer cutting machine, aiming to overcome the deficiency of low water removal efficiency of the cutting fluid dewatering device for a silicon wafer cutting machine in the prior art
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] A cutting fluid dewatering structure for a silicon wafer cutting machine of the present invention will be further described below in conjunction with the accompanying drawings. like figure 1 , figure 2 , image 3 As shown, a cutting fluid dewatering structure for a silicon wafer cutting machine, see figure 1 , including a water supply pipeline 1, a preheating box 2, a diversion box 3 and at least two heating boxes 4, the water supply pipeline 1 is connected to the water supply system, and is used to lead the cutting fluid into the preheating box 2 for preheating, the water supply The pipeline 1 communicates with the preheating box 2, and the preheating box 2 communicates with the splitter box 3, and the splitter box 3 is provided with a splitter valve 5 for separating the cutting fluid in the splitter box 3 into at least two tributaries, each A heating box 4 is provided on the tributaries, and the heating box 4 is provided with an exhaust pipe 6 and a drain pipe 7, ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a cutting fluid dehydrating structure for a silicon wafer cutting machine. By the adoption of the cutting fluid dehydrating structure for the silicon wafer cutting machine, the technical problem that in the prior art, a cutting fluid dehydrating device of the silicon wafer cutting machine is low in dehydrating efficiency is solved. The cutting fluid dehydrating structure for the silicon wafer cutting machine comprises a preheating box, a flow divider box, a flow divider valve and at least two heating boxes. Cutting fluid is preheated through the preheating box and then enters the flow divider box to be divided into at least two branches through the flow divider valve, and the heating boxes are arranged on the branches respectively. The preheated cutting fluid is divided and then heated, and thus the dehydrating efficiency of a cutting fluid dehydrating structure is greatly improved.
Description
technical field [0001] The invention relates to a silicon wafer cutting machine accessory, in particular to a cutting fluid dewatering structure for a silicon wafer cutting machine. Background technique [0002] The on-line mortar recovery technology in silicon wafer cutting has begun to rise in China. More and more manufacturers have begun to purchase equipment to recycle mortar by themselves. However, the moisture in the recycled cutting fluid will increase with the increase in recycling times. The upper limit of water content is different, but the lower the water content in the cutting fluid, the higher the product qualification rate. Now many manufacturers specializing in recycling mortar use distillation equipment to distill the separated cutting fluid, but the existing distillation equipment is relatively expensive, and the utilization rate of heat energy is low, the waste is serious, and it takes a long time. It is not practical for small and medium-sized enterprises...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/00B28D5/00
Inventor 陈小力张光法
Owner ZHEJIANG HUIHONG SOLAR ENERGY CO LTD