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Electroplating fixture

An electroplating jig and jig technology, applied in the electrolytic process, electrolytic components and other directions, can solve the problem of large gold consumption, and achieve the effect of reducing waste

Active Publication Date: 2017-10-31
DONGGUAN SIWEB CONNECTORS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an electroplating fixture for solving the problems of large gold consumption in the prior art

Method used

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  • Electroplating fixture
  • Electroplating fixture
  • Electroplating fixture

Examples

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Embodiment Construction

[0048] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0049] see Figure 1 to Figure 9 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...

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Abstract

The invention provides an electroplating fixture, which has a clamping component that can elastically clamp and position a round conducting wire. The clamping assembly can shield the non-selective area of ​​the clamped round conductive wire and expose the selective area of ​​the clamped round conductive wire to contact with the electroplating solution, and can only treat the round conductive wire during the electroplating process. Electroplating is carried out on selective areas, so as to reduce the waste of electroplating materials in the electroplating solution, and can be used to reduce the waste of gold in the process of making conductive terminals of twisted pair connectors. In addition, it also has a jig shroud to slow down the flow rate of the plating solution inside the electroplating jig.

Description

technical field [0001] The invention relates to an electroplating jig, in particular to an electroplating jig for electroplating selective areas of round conductive wires in an electroplating tank. Background technique [0002] With the popularization and development of the network, twisted-pair connectors that can be used for high-speed signal transmission are widely used. Twisted-pair connectors are mainly divided into two types, one is the RJ11 connector used in telecommunication networks, and the other is RJ45 connectors for local area network and broadband network applications. The conductive terminals of twisted-pair connectors are usually made of copper, but copper is prone to oxidation and reduces conductivity after long-term use. In order to increase the conductivity and oxidation resistance of copper, copper is usually plated with a Nickel layer, because the reduction potential of nickel is lower than that of copper, and it is easier to oxidize than copper, a dens...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/02C25D7/06C25D17/06
Inventor 于长弘
Owner DONGGUAN SIWEB CONNECTORS
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