A method for manufacturing a four-layer rigid-flex board with a total thickness greater than 0.32mm and a plug-in handle in the middle

Abstract

The invention relates to a preparation method for a four layer rigid-flex combination board with thickness over 0.32 mm and a plugging handle in the middle, comprising steps of S1 lamination, S2 X-RAY target shooting, S3 plate edge milling, S4 thinning copper, S5 outer layer hole drilling, S6 burring, S7 glue refuse removal, S8 copper deposition, S9 copper plating, S10 prior processing of an outer layer circuit, S11 outer layer film pressing, S12 outer layer circuit exposure, S13 image development, S14 outer layer circuit etching-DES, S15 outer layer AOI detection, S16 resistance welding prior processing, S17 resistance welding printing, S18 pre-baking, S19 welding resistance exposure, S20 resistance welding exposure, S21 post baking, S22 groove milling, S23 cover lifting, S24 gold melting, S25 first time silk screening, S26 first time baking, S27 second time silk screening, S28 second time baking, S29 board milling, S30 punching, S31 fly probe test, S32 finished quality checking-FQC, S33 packaging, and S34 warehousing. The invention is simple in operation, high in efficiency and easy to implement.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a method for manufacturing a four-layer rigid-flex board with a total thickness greater than 0.32 mm and a plug-in handle in the middle. Background technique [0002] With the development of electronic products towards thinner, shorter and multi-functional, the required circuit boards should not only have the welding stability of rigid printed circuit boards, but also have the flexibility of flexible printed circuit boards, so rigid-flexible boards are the main development trend. However, flexible printed circuit boards are usually connected to other components with plugging fingers. When inserting and pulling fingers in the middle layer of the layer structure, the fingers are etched or etched away due to improper protection. Use a single-sided flexible base material for uncovering. Due to the thickness of the prepreg, the height difference after lamination is large. The...

AI Technical Summary

Problems solved by technology

Use a single-sided flexible base material for uncovering. Due to the thickness of the prepreg, the height difference after lamination is large. The dry film cannot protect the corners, resulting in irregular edges of the copper strips after etching, and it is impossible to tear off the flexible board material neatly.

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