Micro-silicon resonance accelerometer with temperature stress compensation and vibration decoupling capabilities

Abstract

The invention provides a micro-silicon resonance accelerometer with temperature stress compensation and vibration decoupling capabilities. The micro-silicon resonance accelerometer comprises main parts including mass blocks, a lever, a lever supporting cantilever, resonance tuning forks, mass block supporting arms and the like. When the temperature of the environment of the accelerometer is changed, the length of a resonance beam is changed. The thermal deformation size of the lever supporting cantilever is matched with the thermal strain of the resonance beam, so that axial thermal stress of the resonance beam is sufficiently released; the resonance efficiency of the resonance tuning forks is not influenced by the thermal stress. When one tuning fork vibrates, weak displacement is generated in the axial direction to draw the mass block to vibrate, and draw the tuning fork on the other side to from vibration coupling. When the vibration frequencies of the two tuning forks are the same, the vibration frequency is not changed along with the change of the load, and a sensitivity dead zone is formed. The size of the range is directly related with a vibration coupling degree. Therefore, the whole structure of the accelerometer is divided into two symmetrical parts; the two mass blocks in the middle are supported through the mass block supporting arms respectively and the sensitivity dead zone is reduced to the minimum size.

Description

technical field [0001] The invention relates to a silicon micro-resonance accelerometer with temperature stress compensation and vibration decoupling capabilities, which belongs to the field of frequency output accelerometer structure design, and the technical direction of temperature stress and vibration decoupling. Background technique [0002] The temperature compensation technology of the frequency output accelerometer is a key technical issue in the design and debugging process of the accelerometer. The differential output structure of double tuning fork is an effective way of temperature compensation, which is adopted by various frequency output accelerometer structures (French ONERA, American Kearfort, Holleywell, etc.). But this method is a follow-up processing compensation method. The resonant frequency of each single tuning fork still changes with the temperature. The temperature stress felt by the tuning fork has not been eliminated, and the problem has not been f...

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is: the present invention overcomes the deficiencies of the prior art, proposes a silicon microresonant accelerometer with temperature stress compensation and vibration decoupling capabilities, solves the problem of thermal stress release of the tuning fork under high and low temperature conditions, and The Sensitivity Dead Zone Problem Produced by the Vibration Coupling of Two Tuning Forks

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