Circuit mechanical shock test fixing device

Abstract

The invention relates to a circuit mechanical shock test fixing device. The circuit mechanical shock test fixing device is characterized by comprising a supporting plate (1) and a pressing plate (2); a groove (1a) is formed in the supporting plate (1), lower pin insertion holes (1b) are formed in the groove (1a), and four lower installation through holes (1c) are evenly distributed in the supporting plate (1); upper pin insertion holes (2b) correspondingly matched with the lower pin insertion holes (1b) in the supporting plate (1) in a one-to-one manner are formed in the pressing plate (2), four upper installation through holes (2a) are evenly formed in the pressing plate (2), and the upper installation through holes (2a) are correspondingly communicated with the lower installation through holes (1c) in the supporting plate (1) in a one-to-one manner; and the supporting plate (1) and the pressing plate (2) are in immovable fit through nuts and bolts which are arranged on the corresponding upper installation through holes (2a) and the corresponding lower installation through holes (1c) in a matched manner. The circuit mechanical shock test fixing device has the beneficial effects that the structure is simple, installation is convenient, circuits are not damaged, the accuracy is high, and the using universality is high.

Description

technical field [0001] The invention relates to a microcircuit fixing device, in particular to a fixing device for a circuit mechanical impact test. Background technique [0002] Microelectronics technology is an important way to realize the miniaturization, multi-function, and high reliability of electronic systems, and has been widely used in various product equipment in recent years. The purpose of the mechanical shock test is to determine whether the microcircuit can be used in electronic equipment that needs to withstand severe shocks. The shock may destroy the working characteristics or cause damage similar to that caused by too strong vibration. If the shock pulse is repetitive, the damage is more serious. [0003] When carrying out impact tests on metal tube package circuits with regular appearance, there are two general fixing methods: [0004] The first case is: a circuit with only double-column outer pins, usually the fixing method is: [0005] Put the circuit ...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the defects such as difficulty in fixation, uneven stress on the microcircuit during impact, and easy damage to the substrate of the microcircuit when the mechanical impact test is carried out on the metal tube package microcircuit, and the proposed circuit mechanical impact test Fixtures

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