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Semiconductor package and method

A packaging and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as complex design and density limitations

Active Publication Date: 2018-12-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although significant improvements in lithographic processes have considerably improved the formation of 2D ICs, there are limits to the densities that can be achieved in two dimensions
One of these constraints is the minimum size required to manufacture these components
And, take advantage of more complex designs when placing more devices on a chip

Method used

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  • Semiconductor package and method
  • Semiconductor package and method
  • Semiconductor package and method

Examples

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Embodiment Construction

[0044] The following disclosure provides a variety of different embodiments or examples for implementing different features of the present invention. Specific examples of components and arrangements will be described below to simplify the invention. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming the first part above or on the second part may include an embodiment in which the first part and the second part are in direct contact, or may include other parts that may be formed between the first part and the second part An embodiment in which the first part and the second part are not in direct contact. In addition, the present invention may repeat reference symbols and / or characters in multiple instances. This repetition is used for simplification and clarity, and does not itself represent the relationship between the multiple embodiments and / or configurations.

[0045] Refer now figure 1 , The fi...

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Abstract

The present invention provides semiconductor packages and methods. The first package is bonded to the first substrate with first and second external connectors. The second external connection is formed using a different material than the first external connection to provide a thermal path from the first package. In one particular embodiment, the first external connection is a solder ball and the second external connection is a copper bump.

Description

Technical field [0001] The present invention relates to semiconductor packages and methods. Background technique [0002] Since the invention of the integrated circuit (IC), the semiconductor industry has experienced rapid development due to the continuous increase in the integration density of various electronic components (ie, transistors, diodes, resistors, capacitors, etc.). To a large extent, the increase in integration density is due to the continuous reduction of the smallest component size, which allows more components to be integrated in a given area. [0003] These integration improvements are actually two-dimensional (2D) because the volume occupied by integrated components is basically located on the surface of the semiconductor wafer. Although significant improvements in photolithography have considerably improved the formation of 2D ICs, there are limits to the density that can be achieved in two dimensions. One of these limitations is the minimum size required to m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L2924/181H01L2924/15311H01L2224/80904H01L23/49816H01L21/568H01L24/03H01L24/05H01L24/08H01L24/80H01L25/105H01L2224/0345H01L2224/0361H01L2224/05624H01L2224/05647H01L2224/08225H01L2224/80006H01L2224/9202H01L2924/18161H01L23/3677H01L23/49811H01L23/49838H01L23/5389H01L25/16H01L23/3128H01L2924/00012H01L2924/00014H01L25/0657H01L2225/06548H01L2225/06517H01L2225/06555H01L23/3675H01L2225/0652H01L2225/06572H01L2225/06589H01L21/4853
Inventor 余振华郑心圃叶德强陈宪伟谢政杰邱铭彦
Owner TAIWAN SEMICON MFG CO LTD