Heat radiation device and refrigerator

A cooling device and refrigerator technology, applied in the field of heat dissipation, can solve the problem of low efficiency of semiconductor refrigeration, achieve the effect of reducing internal space restrictions and improving stability
CN105300147AActive Publication Date: 2016-02-03GREE ELECTRIC APPLIANCES INC
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GREE ELECTRIC APPLIANCES INC
Publication Date
2016-02-03

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Abstract

The invention discloses a heat radiation device and a refrigerator, and relates to the technical field of heat radiation. According to the main technical scheme, the heat radiation device comprises a heat pipe and a heat radiator. The heat pipe is provided with a condensation segment and at least two evaporation segments. The condensation segment is arranged between any two adjacent evaporation segments. The heat radiator comprises cooling fin assemblies arranged on the condensation segment. The evaporation segments of the heat pipe are used for being connected with the hot end of a semiconductor refrigeration plate so that liquid work media in the evaporation segments can absorb heat of the hot end of the semiconductor refrigeration plate and then be vaporized. The vaporized work media diffuse in the condensation segment, and the vaporized work media in the condensation segment are cooled by the heat radiator to be liquefied. The liquefied work media flow back into the evaporation segments. The heat radiation device is mainly used for providing a heat pipe heat radiation structure suitable for the hot end of the semiconductor refrigeration plate, the heat radiation stability of the heat radiation device is improved, and the performance of the semiconductor refrigerator is guaranteed.
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Description

technical field

[0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device and a refrigerator. Background technique

[0002] The refrigeration principle of semiconductor refrigerators is completely different from that of ordinary refrigerators. It uses semiconductor refrigerating sheets to achieve cooling through heat dissipation and conduction technology of heat sinks and automatic variable pressure and variable flow control technology. Among them, factors such as semiconductor material, power supply, and heat dissipation at the hot end will affect the cooling effect of the semiconductor cooler. Among these factors, the influence of semiconductor hot-side heat dissipation is particularly obvious.

[0003] In order to improve the heat dissipation efficiency of the hot end of the semiconductor, the heat dissipation structure of the hot end of the semiconductor cooling fin gradually uses an integral sintered heat pipe f...

Claims

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