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Method for preparing LEDs with different light colors based on metal nano-cluster packaging material

A technology of metal nano-clusters and packaging materials, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high cost, low luminous efficiency, and restrictions on the development of LEDs, and achieve the effect of low risk and easy operation

Inactive Publication Date: 2016-02-03
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for direct synthesis of small particles with unique properties that are useful for various applications like lighting or display devices. These tiny objects consist mainly made up of atoms called gold (Au) clustered together through strong bonds formed during crystal growth. By adjusting specific ratios involved in this structure, it becomes possible to create new types of luminescent material without any extra steps needed afterward. Overall, this method provides technical benefits over existing methods which require multiple treatments before assembling them into products.

Problems solved by technology

The technical problem addressed in this patented text relates to finding suitable high-performance fluorescing materials for use in making LED lights without causing unwanted particles or reducing brightness levels over longer periods.

Method used

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  • Method for preparing LEDs with different light colors based on metal nano-cluster packaging material
  • Method for preparing LEDs with different light colors based on metal nano-cluster packaging material
  • Method for preparing LEDs with different light colors based on metal nano-cluster packaging material

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Add 5mL of 1-octadecene to a 20mL beaker, and dissolve 0.2mmol of CuCl 2 2H 2 O (the concentration of the metal precursor solution is 0.01 mol / L), under magnetic stirring at room temperature, add 1 mmol of dodecyl mercaptan dropwise and keep stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters . Maintaining stirring at room temperature for 0.5 h, a spherical assembly structure packaging material of Cu nanoclusters with a diameter of about 200 nm can be obtained, and the spherical assembly structure packaging material of Cu nanoclusters has orange-red fluorescence. Finally, after centrifugation, drying, and powder treatment (the product is about 30 mg, the powder mesh number is 400), the Cu chip assembly structure packaging material of 5 mg is taken and blended with the prepolymer of polydimethylsiloxane of 15 mg (mass ratio It is 1:3), and then coated on the GaN-based LED chip, and polymerized at 60°C for 2 hours to obtain a packaged LED light sou...

Embodiment 2

[0030] Add 5mL of 1-octadecene to a 20mL beaker, and dissolve 1.6mmol of CuCl 2 2H 2O (the concentration of the metal precursor solution is 0.08 mol / L), under magnetic stirring at room temperature, add 1 mmol of dodecyl mercaptan dropwise and keep stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters . Stirring at room temperature for 1 hour can obtain Cu nanocluster flakes (length 50-400nm, width 50-400nm, thickness <5nm) assembly structure encapsulation material, and this Cu nanocluster flake assembly structure encapsulation material has light yellow fluorescence. Finally, through centrifugation, drying, and powder processing (about 100 mg of the product), the sheet assembly structure packaging material of the Cu nanoclusters of 5 mg is blended with the prepolymer of polydimethylsiloxane of 15 mg (mass ratio is 1: 3), and then coated on a GaN-based LED chip, and polymerized at 80° C. for 5 hours to obtain a packaged light-yellow LED light source.

Embodiment 3

[0032] Add 5mL of 1-octadecene to a 20mL beaker, and dissolve 0.2mmol of CuCl 2 2H 2 O, under magnetic stirring at room temperature, 1 mmol of dodecyl mercaptan was added dropwise and kept stirring for 3 min to obtain dodecyl mercaptan-stabilized Cu nanoclusters. Stirring treatment at 50°C for 3 hours can obtain Cu nano-cluster thick sheet (length 100-400nm, width 100-400nm, thickness > 5nm) assembly structure packaging material, this Cu nano-cluster thick sheet assembly structure packaging material has green fluorescence. Finally, after centrifugation, drying, and powder treatment (the product is about 30 mg), take 5 mg of Cu chip assembly structure packaging material and blend it with 15 mg of polydimethylsiloxane prepolymer (mass ratio is 1:3), Then it is coated on a GaN-based LED chip and polymerized at 60° C. for 5 hours to obtain a packaged LED light source that emits green light.

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Abstract

The invention uses a metal nano-cluster novel light-emitting material to act as an innovative LED packaging material so as to realize construction of high-performance LEDs, specifically relates to LED construction of a novel packaging material based on a metal nano-cluster assembly structure which is controllable in light color, strong in fluorescence and high in stability, and particularly relates to a method for preparing a high-performance fluorescent metal nano-cluster assembly structure quickly, simply and safely in a high-yield mode. Pre-preparation of metal nano-clusters is directly reduced and stabilized by hydrosulfuryl molecules, nano-cluster assembly structures with different light colors are realized through regulating the type of metal sources, the type of the hydrosulfuryl molecules, the feeding proportion of reactants, the reaction time, the temperature and the like, and finally, the nano-cluster assembly structures are applied to an LED packaging material so as to realize construction of a high-performance LED light source. The method provided by the invention is simple and convenient to operate in the preparation, assembling and packaging process and small in dangerousness, and has good experimental repeatability.

Description

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Claims

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Application Information

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Owner JILIN UNIV
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