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High-pass filter and low-pass filter using through-glass via technology and manufacturing method thereof

A low-pass filter and filter technology, which is applied to electrical components, multi-terminal pair networks, impedance networks, etc., can solve the problems of reducing filter size and reducing electromagnetic coupling

Inactive Publication Date: 2018-07-24
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, it is also challenging to reduce the electromagnetic coupling between the various components in the filter design while simultaneously reducing the size of the filter

Method used

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  • High-pass filter and low-pass filter using through-glass via technology and manufacturing method thereof
  • High-pass filter and low-pass filter using through-glass via technology and manufacturing method thereof
  • High-pass filter and low-pass filter using through-glass via technology and manufacturing method thereof

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Embodiment Construction

[0023] The detailed description, set forth below in connection with the accompanying drawings, is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details in order to provide a thorough understanding of various concepts. It will be apparent, however, to one skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts. As used herein, the use of the term "and / or" is intended to mean an "exclusive or", and the use of the term "or" is intended to mean an "exclusive or".

[0024] figure 1 is a schematic diagram of a doubly-fed antenna chipset 100 employing a filter according to an aspect of the present disclosure. The dual-feed antenna chipset 100 includes a low-pass...

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PUM

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Abstract

The filter includes a glass substrate with through-board vias. The filter also includes a capacitor supported by the glass substrate. These capacitors may have a width and / or thickness smaller than the printing resolution. The filter also includes a 3D inductor within the substrate. The 3D inductor includes a first set of traces coupled to the through-board vias on the first surface of the glass substrate. The 3D inductor also includes a second set of traces on the second surface of the glass substrate coupled to opposing ends of the through-board vias. The second surface of the glass substrate is opposite to the first surface of the glass substrate. These through-board vias and traces work as 3D inductors. The first set of traces and the second set of traces may also have a width and / or thickness less than the printing resolution.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of US Provisional Patent Application No. 61 / 829,714, filed May 31, 2013, in the name of C. Zuo et al., the disclosure of which is expressly incorporated herein by reference in its entirety. technical field [0003] The present disclosure generally relates to integrated circuits (ICs). More specifically, an aspect of the present disclosure relates to the design of high-pass filters and low-pass filters using through-board via (eg, through-glass via) technology. Background technique [0004] Low-pass filters and high-pass filters can be used to reject harmonics in communication signals. Low-pass filters and high-pass filters can also be used in carrier aggregation systems that combine multiple component carriers to achieve high data transfer rates in wireless communications. However, in carrier aggregation applications, low-pass and high-pass filters specify very low levels of insert...

Claims

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Application Information

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IPC IPC(8): H03H7/01
CPCH03H7/0115H03H7/0138
Inventor C·左J·金C·H·尹D·D·金M·F·维纶茨J-H·兰R·P·米库尔卡M·M·诺瓦克
Owner QUALCOMM INC