Side-by-side positioning mechanism for semiconductor components and its testing device
A positioning mechanism and testing device technology, applied in the direction of single semiconductor device testing, etc., can solve the problems of unsuitable crystal grains, difficult processing of elastic units, durability and decreasing clamping force, etc.
Active Publication Date: 2018-08-28
KING YUAN ELECTRONICS
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Problems solved by technology
[0004] However, the elastic unit used in this design is not easy to process, and it is prone to elastic fatigue if used for a long time, so its durability and clamping force will decrease with time; in addition, regarding this The design concept of the invention of the clip method is not suitable for the alignment of the die, because the force of the clip may cause the phenomenon of die breakage
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[0026] see figure 1 , is a perspective view of the semiconductor element side-by-side positioning mechanism according to the first preferred embodiment of the present invention. The figure shows a side-by-side positioning mechanism 1 for semiconductor components, which includes: a base 2 , an adsorption carrier 3 and a calibration sheet 4 . Please also see figure 2 , is an exploded view of the semiconductor element side-by-side positioning mechanism according to the first preferred embodiment of the present invention.
[0027] like figure 1 , figure 2 As shown, a base 2 includes a base 21 and two pads 22 . Basically, the two pads 22 are used to set up an accommodating space as a sliding space for absorbing the carrier 3 . The base 21 is provided with a slide rail 23 and a power source 24. In the present embodiment, the slide rail 23 is a linear slide rail arranged on both sides of the power source. The power source is an air supply device (not shown in the figure) Sh...
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The invention relates to a semiconductor element sidelining positioning mechanism and a test device thereof. The test device integrates the semiconductor element sidelining positioning mechanism, an inlet / outlet module and a taking-up / putting-down unit. The semiconductor element sidelining positioning mechanism comprises a base, an adsorption carrier base and a correction sheet. The base comprises a bottom base and two cushion blocks, wherein the bottom base is provided with a slide rail and a power source. The adsorption carrier base is connected with at least one connection pipe, and is slidably arranged on the slide rail. The correction sheet has at least one groove and is fixedly arranged on the two cushion blocks. When the adsorption carrier base can be moved to a specific place on the slide rail through the power source, a semiconductor element arranged on a ceramic adsorption base is positioned to the opposite corners of the groove. Therefore, under the condition of not changing any tool, the semiconductor element is positioned accurately, thereby facilitating users to carry out taking-up / putting-down operation repeatedly and enhancing efficiency of semiconductor element detection.
Description
technical field [0001] The invention relates to a side-by-side positioning mechanism and a testing device thereof for a semiconductor element, in particular to a side-by-side positioning mechanism and a testing device suitable for semiconductor components. Background technique [0002] Regarding the positioning mechanism of semiconductor components, in the past, the German manufacturer MultiTest has used side-by-side technology to push the positioning of semiconductor components to the corresponding corners. The invention of the "elastic unit applied on the abutment of the alignment jig" explores this side-by-side positioning concept. [0003] see Figure 8 , is a perspective view of a known side-by-side positioning mechanism for a semiconductor element. The figure shows an alignment jig 910 for a semiconductor element, which mainly includes an elastic unit fixture 982, an elastic unit 941, a first abutting portion 931, and a second abutting portion 951 And the bottom plate...
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IPC IPC(8): G01R31/26
Inventor 陈峰杰詹勋亮林文婷陈盈宏
Owner KING YUAN ELECTRONICS