LED packaging structure

A technology for LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the manufacturing cost of the packaging structure, insufficient light saturation of the product, and halo of the packaging structure.

Inactive Publication Date: 2016-02-24
BRIGHT INT ZHENJIANG ELECTRICITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The reflective layer is usually made of plastic. When such plastic is miniaturized and the reflective layer is thinned, the light of the LED chip will easily pass through the reflective layer. Because of the refraction of light passing through the reflective layer, the encapsulation structure produces a halo phenomenon
The current improvement methods include covering the reflective layer with a metal layer or thickening the reflective layer. These improved methods will increase the manufacturing cost of the packaging structure and are not conducive to the development of miniaturized product design.

Method used

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  • LED packaging structure

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Embodiment Construction

[0009] In order to make the content of the present invention more clearly understood, the present invention will be further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0010] Such as figure 1 As shown, an LED packaging structure includes an LED chip 8, a positive electrode sheet 7, a negative electrode sheet 4, a heat dissipation substrate 5, an encapsulating colloid 1 and a reflective cup 2, the LED chip 8 is packaged in the encapsulating colloid 1, and the LED chip 8 is connected to the positive electrode The sheet 7 is electrically connected to the negative electrode sheet 4 , the bottom surface of the LED chip 8 is against the heat dissipation substrate 5 , the encapsulant 1 is filled in the reflective cup 2 , and a light absorbing layer 3 is provided on the outside of the reflective cup 2 .

[0011] In order to improve the heat dissipation effect, a layer of silicone grease layer 6 is provided on the bottom ...

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PUM

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Abstract

The invention discloses an LED packaging structure comprising an LED chip, a positive electrode plate, a negative electrode plate, a heat radiation substrate, packaging gel and a reflecting cup. The LED chip is packaged in the packaging gel. The LED chip is electrically connected with the positive electrode plate and the negative electrode plate respectively. The bottom surface of the LED chip abuts against the heat radiation substrate. The packaging gel fills in the reflecting cup. The external side of the reflecting cup is also provided with a light absorption layer. Generation of the halo effect can be avoided, emergent light quality can be increased and heat radiation is great.

Description

technical field [0001] The invention relates to an LED packaging structure, belonging to the technical field of LED packaging. Background technique [0002] At present, the LED industry is one of the most eye-catching industries in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, in order to obtain the required brightness and color for LED high-power products, a reflective layer is provided in the LED packaging structure. The reflective layer is usually made of plastic. When such plastic is miniaturized and the reflective layer is thinned, the light of the LED chip will easily pass through the reflective layer. Because of the refraction of light passing through the reflective layer, the encapsulation structure produces a halo phenomenon. The current improvement methods include covering the reflective layer with a metal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/64
CPCH01L33/58H01L33/641H01L33/644
Inventor 陈彬
Owner BRIGHT INT ZHENJIANG ELECTRICITY
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