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High-heat conductivity heat-conduction silica gel pad and preparation method thereof

A heat-conducting silica gel with high thermal conductivity technology, applied in the field of heat-conducting materials, can solve problems such as poor flexibility and difficult performance

Inactive Publication Date: 2016-03-02
SHENZHEN DARBOND INTERFACE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary thermally conductive silicone gaskets generally use spherical alumina fillers to improve thermal conductivity, but the higher the filler coefficient, the worse the product flexibility, and it is difficult to balance the performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Add 10 parts of methyl silicone oil, 10 parts of vinyl silicone oil, 1 part of hydrogen-containing silicone oil, 0.1 part of catalyst, 0.02 part of inhibitor and 1 part of coupling agent into the stirring tank and stir for 1 hour at a speed of 120r~160rpm, then add 500 parts of spherical alumina were stirred for 0.5 hours at a speed of 60r-80rpm; after stirring evenly, 100 parts of MCMB were added at a speed of 20r-40rpm; vacuum was removed to remove air bubbles to obtain a paste material. The paste material is calendered in the middle of the PET release film into a sheet with a thickness of 0.2~5mm, cured at 120~150°C for 0.5 hours, and cut into a sheet of 200mm×200mm to make the thermally conductive silicone pad piece.

Embodiment 2

[0019] Add 10 parts of methyl silicone oil, 20 parts of vinyl silicone oil, 3 parts of hydrogen-containing silicone oil, 0.3 parts of catalyst, 0.05 parts of inhibitor, and 3 parts of coupling agent into the stirring tank and stir for 1 hour at a speed of 120r~160rpm, then add 800 parts of spherical alumina were stirred for 0.5 hours at a speed of 60r-80rpm; after stirring evenly, 200 parts of MCMB were added at a speed of 20r-40rpm; vacuum was removed to remove air bubbles to obtain a paste material. The paste material is calendered in the middle of the PET release film into a sheet with a thickness of 0.2~5mm, cured at 120~150°C for 0.5 hours, and cut into a sheet of 200mm×200mm to make the thermally conductive silicone pad piece.

Embodiment 3

[0021] Add 10 parts of methyl silicone oil, 15 parts of vinyl silicone oil, 2 parts of hydrogen-containing silicone oil, 0.2 parts of catalyst, 0.04 parts of inhibitor and 2 parts of coupling agent into the stirring tank and stir for 1 hour at a speed of 120r~160rpm, then add 700 parts of spherical alumina were stirred for 0.5 hours at a speed of 60r~80rpm; after stirring evenly, 160 parts of MCMB were added at a speed of 20r~40rpm; vacuum was removed to remove air bubbles to obtain a paste material. The paste material is calendered in the middle of the PET release film into a sheet with a thickness of 0.2~5mm, cured at 120~150°C for 0.5 hours, and cut into a sheet of 200mm×200mm to make the thermally conductive silicone pad piece.

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PUM

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Abstract

The invention relates to the technical field of heat conduction materials and concretely relates to a high-heat conductivity heat-conduction silica gel pad and a preparation method thereof. The high-heat conductivity heat-conduction silica gel pad is prepared from 10 parts by weight of methyl silicone oil, 10-20 parts by weight of vinyl silicone oil, 1-3 parts by weight of polyhydrosiloxane, 0.1-0.3 parts by weight of a catalyst, 1-3 parts by weight of a silane coupling agent, 0.02-0.05 parts by weight of an inhibitor, 500-800 parts by weight of spherical alumina and 100-200 parts by weight of mesocarbon microbeads (MCMB). Compared with the prior art, the preparation method utilizes MCMB and a corresponding technology so that a heat conduction coefficient is improved to 5w / m-k or more.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting silica gel gasket with high thermal conductivity and a preparation method thereof. It is used to fill the radiator gap in the electronic industry and improve the life and stability of heat dissipation components. It can be used for a long time at -54-200°C. Background technique [0002] Thermally conductive silicone gaskets are used in heat-generating devices and heat-dissipating devices, which can greatly improve the service life of products. The design functions of electronic components are diversified, and the requirements for thermally conductive materials are getting higher and higher. The thermal conductivity is required to be above 5w / m-k, and the product is also required to have better flexibility. Ordinary thermally conductive silicone gaskets generally use spherical alumina fillers to improve thermal conductivity, but the higher the...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08K13/04C08K3/22C08K3/04C08K7/18
Inventor 王红玉陈田安万炜涛
Owner SHENZHEN DARBOND INTERFACE MATERIALS
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