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Bonding device for bus bars

A bus bar and bonding technology, which is applied in the field of bus bar bonding devices, can solve problems such as uneven bonding acceptance of bus bars, time-consuming and labor-intensive, and out-of-tolerance dimensions, so as to solve the problem of uneven adhesive acceptance and improve Adhesive efficiency, reasonable design effect

Active Publication Date: 2016-03-09
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a solution that solves the problems of time-consuming and labor-intensive bonding of the traditional manual bonding, uneven bonding force of the bus bars, and size out-of-tolerance problems caused by the pressing method, and greatly improves the bonding of the bus bars. efficiency

Method used

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  • Bonding device for bus bars
  • Bonding device for bus bars
  • Bonding device for bus bars

Examples

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Embodiment Construction

[0033] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0034] like Figures 1 to 6 As shown, a bus bar bonding device includes a body 1 for placing a bus bar 4 and a special scraper for scraping off the glue on the surface of the bus bar 4, and also includes a plurality of presses installed on the body 1 Tighten the screw 2 and the backing plate 3, the body 1 is a groove structure, the bottom of the groove structure is fixed with a plurality of evenly distributed and vertically arranged baffles 1-1, and the baffles 1-1 are perpendicular to the The side wall of the groove structure, the height of the baffle 1-1 is lower than the height of the side wall of the groove structure; the two ends of the groove structure are also provided with the baffle 1-1, so The baffle 1-1 ...

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Abstract

The invention relates to a bonding device for bus bars. The bonding device comprises a body for containing the bus bars and a special scraper blade for scrapping off glue liquid on the surfaces of the bus bars and further comprises a plurality of compression screws and a base plate which are installed on the body. The body is of a groove structure. A plurality of stop pieces which are uniformly and vertically disposed are fixed to the bottom of the groove structure. The stop pieces are perpendicular to the side walls of the groove structure. The height of the stop pieces is smaller than that of the side walls of the groove structure. The bonding device for the bus bars has the beneficial effects that the problem of ultra-poor sizes caused by traditional manual bonding and compression modes is solved, and the bonding efficiency of the bus bars is substantially improved.

Description

technical field [0001] The invention relates to the field of bonding devices, in particular to a bonding device for bus bars. Background technique [0002] Bus bars are an important component in phased array radar antennas. There are many T / R components or phase shifters on the large-scale phased array radar antenna array, and the required power lines, control lines, signal lines and ground lines all need to be connected through bus bars. The performance of the bus bar directly affects the reliability of the radar machine. Each bus bar generally contains multiple bus sheets. At present, the bus sheets are stacked and glued together manually. However, due to the uneven pressing force in this bonding method, the size of the bus bar is often out of tolerance, and the production efficiency is low. Low, it is difficult to meet the batch production requirements. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a solu...

Claims

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Application Information

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IPC IPC(8): F16B11/00
CPCF16B11/00
Inventor 朱静唐茂松刘思孙冬云
Owner BEIJING INST OF RADIO MEASUREMENT
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