IC component defect detection method based on X-Ray image

Abstract

The invention discloses an IC component defect detection method based on an X-Ray image. The IC component defect detection method comprises the steps of: carrying out rotational template matching on a measured image, and achieving coarse positioning of a position and an angle of a measured region; positioning a position of a gold wire via a deviation and rotation angle according to the characteristic that the relative position of the gold wire and an overall component is unchanged; eliminating vertical part interference of the gold wire head through gray morphological OPEN operation, and extracting a binary image; eliminating interference according to morphological characteristics, and extracting the main body part of the gold wire; adopting a Hilditch algorithm for refining the binary image, so that the gold wire becomes an elongated contour with the width being a pixel; and determining concavity and convexity of the gold wire through extracting key points of the contour line and analyzing tendency of key points of the contour line and the overall contour, and judging the defect condition of the IC component. The IC component defect detection method achieves defect detection of the IC component quickly and reliably, and has high adaptability.

Description

technical field [0001] The invention relates to the technical field of defect detection of IC components, in particular to an X-Ray image-based defect detection method of IC components. Background technique [0002] An integrated circuit (Integrated Circuit, IC) is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in the circuit are interconnected together, and they are fabricated on a small or several small semiconductor chips or dielectric substrates, and then packaged in a tube. It becomes a microstructure with required circuit functions; all the components in it have been formed into a whole structurally, which makes the electronic components take a big step towards miniaturization, low power consumption, intelligence and high reliability. In order to ensure the quality of IC components, defect detection for IC components is particularly important. However, the current traditi...

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Problems solved by technology

However, at present, the traditional IC component defect detection methods still use manual detection, mechanical detection, etc. These methods generally have the problems of complex process, low detection efficiency, poor quality, instability, and possible damage to components during detection.

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