A kind of ceramic-metal composite binder, preparation method and diamond grinding wheel

Abstract

The invention discloses a ceramic and metal composite binding agent, a preparation method and a diamond grinding wheel. The binding agent is composed of, by weight, 35-40 parts of SiO2, 25-30 parts of H3BO3, 10-15 parts of Li2B4O7, 3-10 parts of AlF3, 2-6 parts of Na2S, 2-5 parts of Fe2N, 3-8 parts of Mg3N2, 2-6 parts of CaF2 and 15-20 parts of lead-tin alloy or nickel-titanium alloy. The binding agent not only has the advantages that the degree of fire resistance is low (as low as 650 DEG C), the thermal expansion coefficient is small (3.0-4.0*10-6 / DEG C), the strength is high (the bending strength reaches 150-220 Mpa), the porosity is adjustable, the self-sharpening performance is good and the chemical stability is good, but also has the excellent properties of high heat conductivity (20-50 W / m.K) and good toughness, is suitable for molding of the diamond grinding wheel, and better meets the requirements of modern precision grinding machining.

Description

technical field [0001] The invention belongs to the technical field of bonding agents for grinding tools, and in particular relates to a ceramic-metal composite bonding agent, and also relates to a preparation method of the ceramic-metal composite bonding agent and a diamond grinding wheel prepared by using the ceramic-metal composite bonding agent. Background technique [0002] In the field of modern manufacturing, grinding has become the most effective and widely used technology for precision and ultra-precision machining. With the continuous development of grinding processing towards high speed, high efficiency and high precision, and in view of the advantages of vitrified bond diamond grinding wheel, such as good rigidity, sharp grinding, high durability, easy dressing and long service life, vitrified bond diamond grinding wheel The scope of application is more and more extensive, and the amount is constantly increasing. [0003] At present, the vitrified binder system ...

AI Technical Summary

Problems solved by technology

Bonds suitable for diamond grinding wheels should have the advantages of low refractoriness, small thermal expansion coefficient, high thermal conductivity, and high strength. However, the existing ceramic bonds have high refractoriness (above 850°C) and large thermal expansion coefficient ( Greater than 6.0×10 -6 / ℃), low thermal conductivity (0~1W / m K), low strength (40~80Mpa) and other shortcomings

Due to the high refractoriness of the bond, the sintering temperature of the vitrified bond grinding wheel is too high, which causes the diamond abrasive to oxidize and decompose, thus losing the proper effect of the abrasive; due to the large thermal expansion coefficient of the bond, it does not match the thermal expansion coefficient of the diamond abrasive. The bonding strength between the abrasive and the bonding agent is reduced; the grinding heat generated during the grinding process cannot be discharged in time due to the low thermal conductivity of the bonding agent, resulting in burns to the workpiece; the strength of the diamond grinding wheel is not high due to the low strength of the bonding agent itself. High, making it difficult to achieve high-speed grinding

[0006] Therefore, the existing vitrified bond cannot fully meet the above-mentioned specific commercial needs, and it is difficult to fully meet the needs of modern high-efficiency precision grinding; prepare a bond with low refractoriness, low expansion coefficient, high thermal conductivity, and high strength of great significance