Electrostatic transducer reliability analysis method and system

Abstract

The invention relates to an electrostatic transducer reliability analysis method and a system. The analysis method comprises steps of imposing bias voltage on an input electrode and a bias electrode of an electrostatic transducer; imposing impulse load on the electrostatic transducer according to the preset impact magnitude and carrying out mechanical impact; monitoring the resistance value between an input electrode and an output electrode of the electrostatic transducer during the mechanical impact; and adjusting the amplitude of the bias voltage and when the resistance value jumps from infinity to the limit value, obtaining and outputting the minimal bias voltage of false triggering the electrostatic transducer via measurement in the current impact magnitude. Thus, it is achieved that in a certain mechanical impact condition, the minimal bias voltage of false triggering caused by down drawing of a movable flat plate can be obtained; the shock resistance design of the electrostatic transducer and prediction and prevention for false contact actions caused by the mechanical impact and static electric power coupling can be obtained; and stability and reliability of the electrostatic transducer are improved.

Description

technical field [0001] The invention relates to the technical field of instrument testing, in particular to an electrostatic transducer reliability analysis method and system. Background technique [0002] Electrostatic transducers are capacitors composed of two conductors that can store opposite charges. They include sensors and actuators in function. Common electrostatic MEMS (MicroElectroMechanicalSystems, microelectromechanical systems) devices include RF (Radio Frequency, radio frequency) MEMS switches, MEMS Inertial devices, MEMS pressure sensors, etc. The parallel plate capacitor structure driven by electrostatic force is usually fixed by a parallel plate (fixed plate), and the other plate is suspended by a mechanical spring (movable plate). When a voltage is applied to the two parallel plates, static electricity will be generated. Electricity and electrostatic force reduce the gap between the two plates, thereby causing displacement and mechanical restoring force. U...

AI Technical Summary

Problems solved by technology

Under the action of mechanical impact, the movable plate will be displaced. From the previous analysis, it can be known that even if the voltage applied between the plates does not change at this time, the electrostatic force will also occur due to the change of the gap between the two plates. Change, which may lead to misoperation of the switch: Under the bias voltage condition that contact should not occur, due to the effect of external mechanical impact, the switch will have an unexpected closing contact action, which seriously affects the stability and reliability of the product.

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