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Telecommunication operation module capable of containing printed circuit board

A printed circuit board and computing module technology, which is applied in the field of accommodating printed circuit boards and electronic devices, can solve the problems of no improvement in the overall heat dissipation effect, increased system load, and increased heat energy of the heat dissipation and air supply device.

Active Publication Date: 2016-03-16
LANNER ELECTRONIC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the power of the cooling and air supply device also relatively increases the system load, the heat energy generated by the cooling and air supply device increases, and the overall cooling effect does not improve. In addition, the volume of the server is always reduced as much as possible to maximize utilization. , therefore, the internal airflow space must be properly utilized in order to achieve the desired cooling effect

Method used

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  • Telecommunication operation module capable of containing printed circuit board
  • Telecommunication operation module capable of containing printed circuit board
  • Telecommunication operation module capable of containing printed circuit board

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Embodiment Construction

[0051] In order to more clearly describe a telecommunications operation module for accommodating a printed circuit board proposed by the present invention, preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0052] The electronic device included in the present invention is defined according to an Advanced Telecommunications Computing Architecture (Advanced Telecommunications Computing Architecture). Please also refer to Figure 1 to Figure 4 ,in, figure 1 It is an exploded schematic view of the main casing of the present invention, figure 2 It is a schematic top view of the main casing of the present invention, image 3 It is a schematic top view of the first main circuit board module of the present invention, Figure 4 It is a three-dimensional schematic diagram of inserting the first main circuit board module and the second main circuit board module into the first accommodating area of ​​the pres...

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Abstract

The invention discloses a telecommunication operation module capable of containing a printed circuit board. Air out of a main shell can be extracted and guided to enter to take heat generated on the circuit board away, and therefore, the damage of the circuit board due to overmuch heat accumulation is avoided. The main shell at least comprises a bottom outer shell and an internal clapboard group, wherein the inner part of the main shell is divided into four containing areas through the internal clapboard group, and the air is introduced in through multiple groups of ventilation openings to achieve a heat dissipation effect.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure applied to accommodating printed circuit boards and electronic devices. Background technique [0002] Electronic products contain electronic components such as resistors, capacitors, and even central processing units, which will generate heat during operation. Excessive heat accumulation will cause the internal temperature of electronic products to be too high and cause damage to components. Therefore, it is necessary to use a heat sink to dissipate heat . The known heat dissipation technology is to install air diffuser in the casing, and use the air convection effect generated by the fan to dissipate heat from the electronic components. In addition, the common heat dissipation technology will install heat pipes or heat dissipation fins and other heat dissipation devices on the electronic components or It is the casing, which exhausts hot air or increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
Inventor 林哲民李文隆
Owner LANNER ELECTRONIC INC
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