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Heat dissipation device and heat dissipating method

A heat dissipation device and heat source technology, applied in the computer field, can solve the problem of low heat dissipation efficiency of chips

Active Publication Date: 2016-03-16
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides a heat dissipation device and a heat dissipation method, which are used to solve the technical problem of low chip heat dissipation efficiency in the prior art

Method used

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  • Heat dissipation device and heat dissipating method
  • Heat dissipation device and heat dissipating method
  • Heat dissipation device and heat dissipating method

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In the case of no conflict, the embodiments and the features in the embodiments of the present invention can be combined arbitrarily with each other. Also, although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in an order different from that shown or described herein.

[0041] Optio...

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Abstract

The present invention discloses a heat dissipation device. The device is used to solve the technical problem of low heat dissipation efficiency of a chip in the prior art. The device comprises a first housing and a second housing, wherein the first housing and the second housing form a closed space; one side of the second housing is in contact with a heat source; the closed space is filled with a heat conducting liquid; and the heat conducting liquid conducts heat of the heat source by flowing.The heat dissipation device further comprises a vibration member arranged in the closed space, wherein the vibration member can perform a mechanical motion so as to make the heat conducting liquid generate turbulent flow according to the mechanical motion of the vibration member. The present invention also discloses a corresponding heat dissipating method.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a heat dissipation device and a heat dissipation method. Background technique [0002] At present, with the development of electronic technology, the function of the chip is becoming more and more powerful, and the power consumption of the chip is also increasing accordingly, which causes the temperature of the chip to be too high and affects the service life. In the prior art, a water-cooling system is generally used to dissipate heat for the chip, that is, a heat dissipation pipe is provided, the heat dissipation pipe is in contact with the chip, water is placed inside the pipe, and the heat on the chip is taken away by the flow of water. [0003] However, the heat dissipation efficiency of the existing method is still low, which cannot meet the requirement of chip heat dissipation. Contents of the invention [0004] The present application provides a heat dissipation devi...

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 马驰州萧惟哲
Owner LENOVO (BEIJING) CO LTD