Polyamide-imide resin, and curable resin composition and cured product of same

一种聚酰胺酰亚胺树脂、固化性树脂的技术，应用在固化性树脂组合物及其固化物,聚酰胺酰亚胺树脂领域，能够解决可使用时间短、处理性不充分等问题，达到可使用时间长、优异透明性的效果

Active Publication Date: 2016-03-16
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curable resin composition obtained by blending the polyamide-imide resin with a curable resin and a reactive diluent tends to have storage stability, short pot life, and insufficient handling properties.

Method used

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  • Polyamide-imide resin, and curable resin composition and cured product of same
  • Polyamide-imide resin, and curable resin composition and cured product of same
  • Polyamide-imide resin, and curable resin composition and cured product of same

Examples

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Embodiment

[0129] Next, the present invention will be further described in detail by showing examples. In the examples, "parts" and "%" are based on mass unless otherwise specified.

Synthetic example 1

[0131] [Preparation of polyamideimide resin (A1-1)]

[0132] Add PGMAc (propylene glycol monomethyl ether acetate) 1086g, IPDI3N (isocyanurate type triisocyanate synthesized by isophorone diisocyanate: NCO%=17.2 ) 587.3g (0.80mol) and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride 499.1g (2.52mol), the temperature was raised to 140°C. The reaction proceeds with foaming. The reaction was carried out at this temperature for 8 hours. A pale yellow liquid was formed in the system, and the characteristic absorption was measured by infrared spectroscopy. As a result, the characteristic absorption of the isocyanate group was 2270cm -1 Completely disappeared at 1780cm -1 、1720cm -1 Absorption of imide groups was confirmed. The acid value was 212 KOHmg / g in terms of solid content, and the molecular weight was 4,700 in number average molecular weight in terms of polystyrene. The concentration of acid anhydride groups was 1.14 mmol / g in terms of solid content. In addition, the...

Synthetic example 2

[0136] [Preparation of polyamideimide resin (A1-2)]

[0137] Add EDGA (diethylene glycol monoethyl ether acetate) 4628g, IPDI3N (isocyanurate type triisocyanate synthesized by isophorone diisocyanate: NCO%= 17.2) 2070 g (2.83 mol) and 1386 g (7 mol) of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, heated to 140°C. The reaction proceeds with foaming. The reaction was carried out at this temperature for 8 hours. A pale yellow liquid was formed in the system, and the characteristic absorption was measured by infrared spectroscopy. As a result, the characteristic absorption of the isocyanate group was 2270cm -1 Completely disappeared at 1780cm -1 、1720cm -1 Absorption of imide groups was confirmed. The acid value was 140 KOHmg / g in terms of solid content, and the molecular weight was 5800 in number average molecular weight in terms of polystyrene. The concentration of the acid anhydride group was 0.75 mmol / g in terms of solid content. In addition, the concentration of...

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Abstract

Provided are a thermosetting resin composition which is soluble in a general-purpose solvent and which gives a cured product (cured coating) having high optical transparency from the visible region to the ultraviolet region near 300 nm, and a polyamide-imide resin suitable for use in preparing the thermosetting resin composition. Specifically, the present invention is: an alcohol-modified polyamide-imide resin obtained by reacting a tricarboxylic anhydride (a2) and an isocyanurate-type polyisocyanate (a1) synthesized from an isocyanate having an aliphatic structure and generating a polyamide-imide resin (a), and then reacting an alcohol compound (b); a curable resin composition containing the polyamide-imide resin; and a cured product of the curable resin composition.

Description

technical field [0001] The present invention relates to a polyamide-imide resin, a curable resin composition containing the polyamide-imide resin, and a cured product thereof. For polymers, the present invention relates to a polyamide-imide resin that can be suitably used in fields requiring transparency in addition to heat resistance, a curable resin composition containing the polyamide-imide resin, and a cured product thereof , such fields include: the field of optical materials; solder resist materials for printed circuit boards, protective materials and insulating materials for household appliances such as refrigerators and rice cookers, liquid crystal displays, liquid crystal display devices, organic and inorganic electroluminescence displays , organic and inorganic electroluminescent devices, LED displays, light-emitting diodes, electronic paper, solar cells, TSV, optical fibers, optical waveguides, etc. used in protective materials, insulating materials, adhesives, refl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/14C08L63/00C08L79/08
CPCC08L63/00C08L79/08C08G73/1035C08G73/14
Inventor 村上晃一宫垣敦志
Owner DIC CORP
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