A method for planarizing the surface cavity of an ltcc substrate
A substrate surface, flattening technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of inability to achieve high-precision conduction bands, inability to achieve flat filling, and no usability, so as to eliminate pollution and surface tension , Improve design universality and eliminate physical differences
Active Publication Date: 2017-12-26
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Problems solved by technology
This is because the photoresist contains a large amount of organic solvents before drying, and the volume will shrink sharply after drying, making it impossible to achieve flat filling
[0006] When the cavity is small and shallow, the photoresist method can slightly flatten the cavity, but it can only be used to make resistors with a precision of 100±10um or more, and cannot achieve high-precision conduction band (20±2um)
In fact, this method has no usability in engineering
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[0022] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0023] The invention discloses a method for planarizing a surface cavity of an LTCC substrate, which specifically includes the following steps:
[0024] Step 1. Press and paste the photosensitive dry film on the surface of the LTCC substrate containing the cavity, so that it covers the cavity area and the plane area of the substrate, and then perform overall exposure and development on the surface of the photosensitive dry film, so that the photosensitive dry film on the edge of the cavity area The film dissolves, the dry film in the entire cavity area falls off, and the dry film in the non-cavity area forms a dry film protective layer. The dry film (Dry film) is relative to the wet film (Wet film). The dry film is a polymer compound that undergoes a polymerization reaction (the reaction process of synthesizing a polymer from ...
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The present invention relates to the technical field of manufacturing of LTCC (Low Temperature Co Fired Ceramic), a thin film and a mixed substrate. The present invention discloses a cavity planarization processing method in the process of manufacturing a thin film circuit on a surface of an LTCC substrate. The method specifically comprises: a first step of pressing and attaching a photosensitive dry film to the surface of the LTCC substrate with a cavity so as to cover a cavity region and a plane region of the substrate, then performing overall exposure and development on a surface of the photosensitive dry film so as to dissolve the photosensitive dry film on an edge of the cavity region, enabling the dry film of the whole cavity region to fall off, and enabling the dry film of a non-cavity region to form a dry film protective layer; a second step of coating silica-gel sol onto the dry film protective layer and into the cavity, scrapping the excessive silica-gel after standing, and after standing once more, putting the coated substrate into an oven to bake and cure the silica-gel so as to form a silica-gel filling block; and a third step of performing magnetic sputtering of an Au film layer on the whole LTCC substrate. Since the influence of the cavity structure is eliminated, a high precision thin film circuit can be directly integrated on the surface of the LTCC substrate, so that design universality is improved, and a multi-variety and small-batch product line is significantly optimized.
Description
technical field [0001] The invention relates to the technical field of LTCC (low temperature co-fired ceramics), thin film and hybrid substrate manufacturing, in particular to a method for flattening the cavity when the thin film circuit is fabricated on the surface of the LTCC substrate. High-precision thin-film circuits are integrated on the surface. Background technique [0002] In the process of making high-precision thin-film circuit graphics (hereinafter referred to as LTCC-D) on the surface of traditional LTCC substrates, due to the existence of the LTCC cavity, on the one hand, it affects the uniformity of glue coating, thereby affecting the precision of thin-film circuit strip lines. On the other hand, the prefabricated printed circuit at the bottom of itself also faces chemical compatibility problems. In order to avoid the influence of the cavity, most of the existing samples adopt a cavity-free design, which limits the application of LTCC-D circuits. [0003] At...
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IPC IPC(8): H01L21/48
CPCH01L21/4846
Inventor 李彦睿王春富秦跃利
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP