Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for associating primary wiring diagram and secondary system logical connection diagram of smart substation

A technology of smart substation and secondary system, which is applied in the association of the wiring diagram of the primary system of the smart substation and the logical connection diagram of the secondary system, the association of secondary equipment, and the field of the substation. The system is out of joint, and the advantages are not fully reflected, so as to achieve the effect of narrowing the scope and facilitating matching

Active Publication Date: 2018-08-10
GRIDNT
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, we only applied the communication service of the 61850 standard, and the model is only in name only, without fully reflecting the advantages of the standard, so there is a phenomenon that the substation primary system model is out of touch with the secondary system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for associating primary wiring diagram and secondary system logical connection diagram of smart substation
  • Method for associating primary wiring diagram and secondary system logical connection diagram of smart substation
  • Method for associating primary wiring diagram and secondary system logical connection diagram of smart substation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] In order to clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific implementation modes and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for associating a primary wiring diagram of an intelligent substation with a logical connection diagram of a secondary system, which includes the following processes: analyzing the SCD configuration file to obtain the basic information of the secondary system of the substation, and establishing the secondary system model of the substation; The primary system model of the substation corresponding to the model; divide the IED equipment into layers, and perform one-to-one parameter and channel configuration between the primary system parameters and the data set in the secondary system IED; based on the establishment of the primary system model The simulation operation shows the main wiring diagram of the substation after associating the secondary system model. The invention solves the configuration problem of measurement parameters and switch parameters in the main wiring diagram, establishes a closed-loop technical system of primary and secondary equipment data, and realizes the high-visibility correlation analysis and debugging function of the intelligent station based on this, and reduces the time required for the selected IED equipment by correlation pairing range, improve the speed of primary and secondary system association, and make the association process more efficient and concise.

Description

technical field [0001] The invention relates to a method for associating primary and secondary equipment of a substation, in particular to a method for associating a wiring diagram of a primary system of an intelligent substation and a logical connection diagram of a secondary system, belonging to the technical field of power system automation. Background technique [0002] Smart substations are developed on the basis of digital substations, and are the latest requirements for substation technical forms in the smart grid environment. Networked information sharing is an important feature of smart substations. The optimization and integration of primary system and secondary system functions and the evolution of equipment forms are based on the premise of free information sharing. Digital network communication realizes multiple information multiplexing, and a small amount of optical fiber replaces a large number of cables in traditional substations. However, at the same time, d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02J13/00G06Q10/06G06Q50/06
CPCG06Q10/067G06Q50/06H02J13/0006H02J2203/20Y02E60/00Y04S10/18
Inventor 陈大川李惠民王乐挺
Owner GRIDNT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com