Polishing solution stirring device and method

A technology of a stirring device and a magnetic stirring device, which is applied in chemical instruments and methods, grinding/polishing equipment, metal processing equipment, etc., can solve the problems of mechanical oil stains and impurities in polishing liquid, achieve enhanced stirring effect, and flexible placement Effect

Inactive Publication Date: 2016-03-30
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The relationship between the liquid supply system and the CMP process equipment is shown in the flow chart figure 1 .Among them, the stirring rod of the mechanical moto

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing solution stirring device and method
  • Polishing solution stirring device and method
  • Polishing solution stirring device and method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] The invention provides a polishing liquid stirring device and method for directly stirring without using a mechanical motor, so as to avoid the problems of mechanical grease and other impurities. Specifically, the present invention provides a polishing liquid stirring device, which includes:

[0024] The mixing tank is used to hold the polishing liquid, and the bottom of the mixing tank has a lower outlet for the liquid to flow out;

[0025] The magnetic stirring device includes a magnetic stirrer fixed on the outside of the mixing tank and a magnetic stirring rotor fixed on the inside of the mixing tank;

[0026] A diaphragm pump, the fluid inlet of which is connected to the lower discharge outlet at the bottom of the mixing tank; and

[0027] The chemical mechanical polishing equipment is connected to the fluid outlet of the diaphragm pump, and the polishing liquid mixed in the mixing tank is supplied to the chemical mechanical polishing equipment through the isolation pump. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a polishing solution stirring device comprising the following structures: a mixing tank used for containing polishing solution, and the bottom of the mixing tank is provided with a lower discharge port allowing liquid to flow; a magnetic stirring device comprising a magnetic stirrer fixed outside the mixing tank and a magnetic stirring rotor fixed in the mixing tank; a diaphragm pump with a liquid inlet connecting with the lower discharge port on the bottom of the mixing tank; a chemically mechanical polishing device connected with a liquid outlet of the diaphragm pump, and the mixed polishing solution in the mixing tank is conducted into the chemically mechanical polishing device through the diaphragm pump. The invention also provides a polishing solution stirring method; the method and device can prevent pollution caused by direct mechanical stirring, and can enhance polishing solution stirring effect.

Description

technical field [0001] The invention relates to an IC manufacturing process, in particular to a chemical mechanical polishing liquid supply system and a stirring method thereof. technical background [0002] Since chemical mechanical planarization (CMP) was introduced into the integrated circuit manufacturing process by IBM in 1990, it has continued to develop and has become one of the key integrated circuit processes to extend Moore's Law. In the chemical mechanical planarization process, the polishing fluid is an important consumable for the CMP process. According to the CMP requirements of different microstructures or different materials, different types of polishing fluids are required. [0003] How to ensure the stability of the CMP process is one of the points of concern. In addition to the need to pay attention to the CMP process itself, the auxiliary system to maintain the normal operation of the CMP process is also critical. The transmission of the polishing liqui...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B24B57/02B01F13/08
Inventor 杨涛卢一泓张月崔虎山
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products