Circuit board manufacturing method and circuit board
A circuit board manufacturing and circuit board technology, which is applied in the directions of printed circuit components, electrical connection printed components, and electrical connection formation of printed components, etc. , to achieve the effect of improving quality, reducing risk, and reducing the possibility of separation
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[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0042] see figure 1 , an embodiment of a method for manufacturing a circuit board in an embodiment of the present invention includes:
[0043] 101. Cover the support plate with a first metal layer including a first metal;
[0044] A support plate is prepared, and the support plate is covered with a first metal layer including a first metal.
[0045] 102. Etching the first metal layer for the first time;
[0046] After the first metal layer is covered on the support plate, a...
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