Portable Strain Gauge Bonding Device

Abstract

The invention discloses a portable strain gauge bonding device. The portable strain gauge bonding device comprises a bracket, a piston, a spring and a strain gauge limiting device, wherein the strain gauge limiting device is mounted at the lower end of the bracket, a mounting through groove is formed in the strain gauge limiting device, the piston is located above the mounting through groove, and the upper side surface of the piston is fixedly connected with the bracket through the spring. According to the portable strain gauge bonding device, a mounting point of a strain gauge is positioned through the mounting through groove, and the spring and the piston continuously apply downward acting force to the strain gauge, so that the positioning is accurate and the bonding effect is stable when the portable strain gauge bonding device is used for bonding the strain gauge; the portable strain gauge bonding device is simple in structure, small in size, convenient to use, accurate in bonding and high in bonding efficiency, does not need manual continuous press application to metal product bonding and is suitable for bonding of the strain gauges on diffident metal inclined planes.

Description

technical field [0001] The invention relates to a bonding structure, in particular to a portable strain gauge bonding device. Background technique [0002] Strain gauges are the most commonly used type of sensors in the industry. By measuring the strain of materials or structures, the properties and structural characteristics of materials can be further grasped. Therefore, strain gauges are widely used in various industrial environments, involving defense industry, aerospace, railway transportation, ships and many other industries. Usually, the bonding of the strain gauges is carried out by manual hands, but the manual bonding is easy to cause the strain gauges to slip during the bonding process, so that the direction of the strain gauge sensitive grid deviates from the measured direction, resulting in measurement errors. At the same time, using glue During the bonding process of the strain gauge, it is necessary to continuously apply pressure to the strain gauge and squeez...

AI Technical Summary

Problems solved by technology

Usually, the bonding of the strain gauges is carried out by manual hands, but the manual bonding is easy to cause the strain gauges to slide during the bonding process, so that the direction of the strain gauge sensitive grid deviates from the measured direction, resulting in measurement errors. At the same time, using glue During the bonding process of the strain gauge, it is necessary to continuously apply pressure to the strain gauge and squeeze out excess glue until the glue solidifies to ensure the bonding strength of the strain gauge and the uniformity of the bonding surface, which greatly increases labor costs and reduces Bonding efficiency of the strain gauge

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