A Wafer Measurement Sampling Method Based on Small Sampling System

Abstract

The invention discloses a small sampling system-based wafer measuring sampling method. The method includes the following steps of: determining if a processing batch is a valuable batch, and determining if a type of the current processing batch firstly reaches the measurement station; determining if the valuable batch reaches the measurement station during a first reference time interval after the processing batch reaches the measurement station; further determining if the valuable batch reaches the measurement station during a second reference time interval before the processing batch reaches the measurement station; and newly building a group, adding the processing batch into the new-built group, and adding identifications that abandon current measurement into wafers in the processing batch. The beneficial effects of the technical scheme are that: a processing technology and processing devices can be monitored through the minimum sample size, so that the measurement efficiency can be improved; the number of samples is decreased, so that a cycle of each measurement step can be shortened; human cost is saved; the measurement capability can be improved; and sampling covers all the processing units in the processing technology, so that potential risks due to unbalanced sampling can be decreased.

Description

technical field [0001] The invention relates to a quality control method in the field of semiconductor processing, in particular to a wafer measurement and sampling method based on a small sampling system. Background technique [0002] Semiconductor processing is the processing process used to make chips. It gradually forms electronic circuits on chips made of semiconductor materials through a series of photographic and chemical processing steps. [0003] Existing semiconductor processing lines need to do a lot of measurement work on products to ensure the stability of processing technology and processing equipment. However, a large amount of measurement work will prolong the processing cycle, and the processing capacity will be limited by the measurement capacity, resulting in a decrease in processing efficiency. At the same time, due to the limitation of the sampling rules of the measurement itself, the measurement cannot fully achieve the expected effect. [0004] Thro...

AI Technical Summary

Problems solved by technology

However, a large amount of measurement work will prolong the processing cycle, and the processing capacity will be limited by the measurement capacity, resulting in reduced processing efficiency

At the same time, due to the limitation of the sampling rules of the measurement itself, the measurement cannot fully achieve the expected effect

[0004] Through the existing measurement and sampling system based on batches and equipment, benefits such as shortening the processing cycle, improving measurement capabilities, and measurement effects can be obtained. However, this system uses a fixed wafer selection rule. The unbalanced wafer selection rules among different processing units in the processing technology cause the potential risk that some processing units may not be monitored in time during certain periods.

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