Crystal bar cutting method and wire saw

Abstract

A method is disclosed for slicing an ingot by which wire rows are formed by using a wire that is spirally wound between a plurality of wire guides and travels in an axial direction. An ingot is pressed against the wire rows while supplying a working fluid to a contact portion of the ingot and the wire, thereby slicing the ingot into wafers, and a ratio of a wire new line feed amount per unit time in slicing of a slicing start portion of a first ingot to that in slicing of a centration portion of the same at the time of slicing the ingot after replacement of the wire is controlled to be ½ or less of the ratio at the time of slicing second and subsequent ingots after the replacement of the wire.

Description

Technical field [0001] The invention relates to a cutting method and a wire saw. The cutting method uses a wire saw to cut an ingot into a wafer shape. Background technique [0002] In recent years, wafers have been increasing in size. With this increase in size, wire saws dedicated to cutting ingots have been used. [0003] A wire saw is a device as described below, which makes a steel wire (high-tension steel wire) travel at a high speed, where the slurry is poured and the workpiece is crimped (for example, silicon ingots. Hereinafter, also referred to as Ingots) are cut to simultaneously cut out multiple wafers (see Patent Document 1). [0004] Here, Figure 4 The outline of an example of a conventional normal wire saw is shown. [0005] Such as Figure 4 As shown, the wire saw 101 is mainly composed of the following components: a steel wire 102, which is used to cut the ingot; a wire guide 103, which is wound with a steel wire 102; a tension imparting mechanism 104, which is used ...

AI Technical Summary

Problems solved by technology

[0012] In addition, if the distribution of the thickness of the wafer cut out from the ingot is confirmed, the thickness of the wafer in the cutting start part of the ingot becomes thinner than that in the central part.

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