Magnetron sputtering equipment and magnetic body device thereof

Abstract

The invention discloses magnetron sputtering equipment and a magnetic body device thereof. The magnetic body device comprises a plurality of first magnetic bodies and a plurality of second magnetic bodies whichare separatelyarranged in a first plane and a second plane in a parallel and spaced manner, wherein the first plane and the second plane are arranged in a spaced manner; the magnetic field intensity of the second magnetic bodies is greater than that of the first magnetic bodies; the second magnetic bodies, relative to the first magnetic bodies, are far away from a target of the magnetron sputtering equipment; the setting directions of magnetic poles of the first magnetic bodies are identical with those of magnetic poles of the second magnetic bodies; and the parallel distance between the first magnetic bodies and the second magnetic bodies in the arrangement direction is zero. The magnetic body device adopts the first magnetic bodies and the second magnetic bodies which have different magnetic field intensities, the first magnetic bodies and the second magnetic bodies are arranged in a parallel and uniformly-spaced manner in two parallel and spaced planes, the parallel distance between the first magnetic bodies and the second magnetic bodies in the arrangement direction is zero, and the distance between the first magnetic bodies and the second magnetic bodies in the vertical direction is not zero, so that the parallel distances among the magnetic bodies are eliminated, the quantity of the magnetic poles is ensured, the magnetic field intensity of the surface of the target is more uniform, and the service life of the target is prolonged.

Description

【Technical field】 [0001] The invention relates to the field of magnetron sputtering, in particular to a magnetron sputtering device and a magnet device thereof. 【Background technique】 [0002] In the flat panel display industry, physical vapor deposition (Physical Vapor Deposition, referred to as PVD) is a common process. In the PVD process, the most commonly used technology is sputtering technology, and magnetron DC sputtering technology is one of them. like figure 1 As shown, in magnetron sputtering, a magnet system 10 is placed behind the target to enhance the sputtering process in the form of magnetic field assistance. The magnet system 10 usually consists of several magnets 11 spaced apart and parallel. These magnets 11 are driven by a group of motors 13, and can move left and right during the process, so that the surface of the target material reaches a relatively balanced magnetic field strength. [0003] However, due to the existence of the distance between sever...

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Problems solved by technology

[0003] However, due to the existence of the spacing between several magnets 11, the magnetic field influence of the area with magnet 11 and the area without magnet 11 on the target is still inconsistent, and the unevenness of the magnetic field strength leads to the speed at which the target is consumed during the sputtering process. Inconsistent, resulting in lower target utilization

However, if you do not use a combination of several magnets, but use a whole magnet, there will be only two magnetic poles, and the distribution of the magnetic field intensity on the surface of the target will be more uneven, which will also reduce the utilization of the target.

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