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Chip card module arrangement, chip card arrangement and method for producing the chip card arrangement

A technology for chip cards and card modules, applied in the fields of chip card module devices, chip card devices and devices for manufacturing chip cards, can solve the problems of reducing the robustness of chip card stress, affecting mechanical stability, etc.

Active Publication Date: 2016-04-20
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The conventional construction of a smart card arrangement or a smart card module arrangement can negatively affect the mechanical stability and thus reduce the robustness of the smart card against stress

Method used

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  • Chip card module arrangement, chip card arrangement and method for producing the chip card arrangement
  • Chip card module arrangement, chip card arrangement and method for producing the chip card arrangement
  • Chip card module arrangement, chip card arrangement and method for producing the chip card arrangement

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Embodiment Construction

[0024] Detailed Description

[0025] Smart cards generally comprise a carrier layer, which may be made of plastic material, in combination with a so-called chip housing, in which one or more semiconductor chips are located. The carrier layer usually has the shape of a plate or foil and can also be a sheet In most cases, two thicker carrier layers are joined to form a smart card and form the upper side and the lower side here. The already mentioned chip housing contains one or more semiconductor chips, also called integrated circuits (ICs), the electronic "heart" of the chip card. One can compare a semiconductor chip in its function with, for example, a processor of a personal computer. Chip cards come in very different sizes and dimensions in order to match them to the respective field of application. The most commonly used size is the check card ("EC card"), which has been standardized in the "ID1" format.

[0026] Chip housings or chip card modules have different embodi...

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PUM

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Abstract

A chip card module arrangement may include (a) a first surface and a second surface, which are opposite from one another, a chip receptacle (b) for one or more semiconductor chips on the surfaces, and (c) a connecting material receiving surface on one of the two surfaces. The connecting material receiving area only takes up a portion of the surface.

Description

technical field [0001] The invention relates to chip cards as well as parts of their construction and their manufacture. Background technique [0002] Chip cards (smart cards or also integrated circuit cards) are used in many different fields of application. For example in personal identification (documents, access cards, authorization cards), in data encryption (code cards), for personal use (bank chip cards, payment cards) and similar areas. Aspects of the design of the chip card and its production may also be durability or robustness, security against counterfeiting and tampering, and the desired functionality, in addition to cost. [0003] Smart cards generally consist of a carrier layer in which one or more semiconductor chips—the electronic “heart” of the smart card—are arranged. [0004] One aspect of chip cards is their durability in actual use with respect to stress both from the environment and by people, ie eg the card holder. These include, for example, temper...

Claims

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Application Information

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IPC IPC(8): G06K19/077
CPCH01L2924/181H01L2224/16225H01L2224/32225H01L2224/73204G06K19/072G06K19/07747G06K19/07754G06K19/07784H01L2924/00012H01L2924/00H01L21/56H01L23/3142H01L23/5388H01L23/66H01L2223/6677
Inventor J·波尔F·皮施纳T·施伯特P·斯坦普卡
Owner INFINEON TECH AG