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Open patch diode

A diode and open technology, applied in the field of open chip diodes, can solve the problems of glass passivation grains only having ordinary rectification function, limiting the use field of chip diodes, low production efficiency, etc., to achieve automatic welding and easy installation. , The effect of convenient later disassembly

Inactive Publication Date: 2016-04-20
TAIZHOU YOUBIN JINGYUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional SMD diodes adopt a frame structure, and the grains used must be glass passivation grains, so the cost will be much higher than that of traditional axial diodes, and the production efficiency is very low, and the glass passivation grains are only ordinary The rectification function greatly limits the application field of SMD diodes. With the development of electronic technology, the volume of diodes is required to be smaller and smaller, while traditional axial diodes cannot meet the requirements.

Method used

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Embodiment Construction

[0013] To make this Invention The existing technical means, creative features, goals and effects are easy to understand, and the following will further elaborate on this invention in combination with specific implementation methods. invention .

[0014] Such as figure 1 with figure 2 as shown, An open patch diode , including a crystal grain 1, a copper lead, a jumper wire 5 and an epoxy plastic package 4, the copper lead includes a lead 2 and a lead 2 3, the crystal grain 1 is encapsulated by an epoxy plastic package 4, and the crystal grain 1 It is an open grain, one end of the jumper 5 is connected to the upper surface of the grain 1, and the other end is connected to the inner end surface of the lead 2 3, and the inner end surface of the lead 2 is connected to the lower surface of the grain 1. 1. The connection between the copper lead wire and the jumper wire 5 is soldered by solder. This kind of open chip diode, through this kind of structural design, uses ope...

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PUM

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Abstract

The invention discloses an open patch diode and relates to the field of diodes. The open patch diode comprises dies, copper leads, a jumper and an epoxy plastic package body. The copper leads comprise a first lead and a second lead. The dies are packaged through the epoxy plastic package body and are open type dies. One end of the jumper is connected to the upper surfaces of the dies, and the other end of the jumper is connected to the inner end face of the second lead. The inner end face of the first lead is connected to the lower surfaces of the dies. The dies, the copper leads and the jumper are welded through welding flux. The open patch diode is simple and compact in structure, small in size, easy to process, low in cost and worthy of popularization, and automatic welding can be achieved.

Description

technical field [0001] The invention relates to the field of diodes, in particular to an open patch diode. Background technique [0002] Traditional SMD diodes adopt a frame structure, and the grains used must be glass passivation grains, so the cost will be much higher than that of traditional axial diodes, and the production efficiency is very low, and the glass passivation grains are only ordinary The rectification function greatly limits the application field of SMD diodes. With the development of electronic technology, the volume of diodes is required to be smaller and smaller, but traditional axial diodes cannot meet the requirements. Contents of the invention [0003] The purpose of the present invention is to provide an open chip diode to solve the above-mentioned defects in the prior art. [0004] An open chip diode, comprising a crystal grain, a copper lead, a jumper wire and an epoxy plastic package, the copper lead includes a lead one and a lead two, the cryst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L29/861
CPCH01L29/861H01L23/3157H01L23/3171H01L2924/00014H01L2224/40245H01L2224/37099
Inventor 黄仲濬蒋文甄
Owner TAIZHOU YOUBIN JINGYUAN TECH CO LTD
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