A double etched double-sided circuit board structure and its production process

Abstract

The invention discloses a secondary etching double-sided circuit board structure and its production process. The double-sided circuit board structure of the present invention comprises: a GTL circuit layer, an insulating PP layer and a GBL step surface circuit layer, and the GBL step surface circuit layer It is composed of GBL inner line layer and GBL outer line layer. The GTL line layer and GBL inner line layer are connected to the insulating PP layer at the same time. The GBL outer line layer is covered on the GBL inner line layer. A double-sided etching The circuit board production process also has the following steps: first circuit production - - - circuit development - - - circuit inspection - - - acid etching - second circuit production - - - circuit development - circuit inspection - - - etching - - - Open and short circuit of electrical test - post process. The invention only needs secondary production, requires less investment, simplifies the production process and operation difficulty, improves the production efficiency, reduces the production cost, reduces the defective rate of products, and shortens the production cycle of products.

Description

technical field [0001] The invention relates to a circuit board production process, in particular to a secondary etching double-sided circuit board production process. Background technique [0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements. In order to solve the above problems, a new type of superimposed circuit board line production update technology was developed to improve the reliability of PCB boards, and at the same time greatly reduce PCB production costs and short...

AI Technical Summary

Problems solved by technology

[0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. In terms of management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet customer requirements.

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