Semiconductor laser module
A laser module, semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser parts, etc., can solve the problems of reliability reduction and damage, and achieve the effect of high reliability
Active Publication Date: 2016-04-20
FURUKAWA ELECTRIC CO LTD
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Problems solved by technology
[0003] In such an optical coupling method, when the output of the semiconductor laser element is high, the adhesive for fixing the optical fiber or the cladding of the optical fiber may be damaged by heat generated by light absorption, and the reliability may be lowered.
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[0050] First, the configuration of the semiconductor laser module according to the embodiment of the present invention will be described. figure 1 It is a schematic plan view of the semiconductor laser module according to the embodiment of the present invention. figure 2 is a representation figure 1 A schematic partial cross-sectional view of the side of the semiconductor laser module shown. The semiconductor laser module 100 according to this embodiment includes: a package 101 as a housing; and an LD height adjustment plate 102, submounts (submounts) 103-1 to 6, and six Semiconductor laser elements 104-1 to 6. package 101 as figure 2 shown with cover 101a, but in figure 1 In , the cover of the package 101 is omitted from illustration. In addition, the semiconductor laser module 100 includes lead pins 105 for injecting current into the semiconductor laser elements 104-1 to 6. Furthermore, the semiconductor laser module 100 includes first lenses 106-1 to 6, second lense...
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This semiconductor laser module (100) is provided with semiconductor laser elements (104-1 - 6) which output laser light; an optical fiber (112) provided with a core part and a clad part formed at the outer periphery of the core part, into which the laser light enters from one end, and which guides the laser light out from the semiconductor laser module; an optical component (116) arranged at the outer periphery of the optical fiber, for anchoring the optical fiber; a first anchoring agent for fixing the optical component and the optical fiber; a light absorber (117) arranged at the outer periphery of the optical component, for anchoring the optical component; a first light-blocking part (113) arranged between the optical component and the laser light entry end of the optical fiber; and a chassis (101) in the interior of which are housed the semiconductor laser elements, the end of the optical fiber on the side at which the laser light enters, and the first light-blocking part. The optical component has optical transparency at the wavelength of the laser light, and the light absorber has light absorbance at the wavelength of the laser light. A highly reliable semiconductor laser module is provided thereby.
Description
technical field [0001] The invention relates to a semiconductor laser module. Background technique [0002] In the past, the following method has been known (for example, refer to Patent Document 1): In the case of outputting laser light from an optical fiber in a semiconductor laser module, a lens or the like for laser light emitted from a semiconductor laser element fixed at a predetermined position on a package is known. Concentrate and couple with optical fiber. [0003] In such an optical coupling method, when the output of the semiconductor laser element is high, the adhesive fixing the optical fiber or the cladding portion of the optical fiber may be damaged due to heat generated by light absorption, resulting in reduced reliability. For this purpose, a method is conventionally known (for example, refer to Patent Document 2) in which an optical fiber is inserted through a transparent glass capillary and the optical fiber is fixed. [0004] prior art literature [0...
Claims
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IPC IPC(8): G02B6/42H01S5/022
CPCG02B6/4206G02B6/4296H01S5/0071H01S5/02216H01S5/02469H01S5/4012H01S5/4043H01S5/02251H01S5/02326G02B6/262
Inventor 石毛悠太早水尚树片山悦治木村俊雄
Owner FURUKAWA ELECTRIC CO LTD