A method of manufacturing a flexible implantable power supply based on infrared light remote charging
A manufacturing method and implantable technology, applied in the field of medical electronics, can solve the problems of complex environment, limited energy transmission distance, unstable energy conversion method, etc., to increase specific surface area, large infrared penetration, and improve light-heat -Effect of electrical conversion efficiency
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Embodiment 1
[0025] A method for manufacturing a flexible implantable power supply based on infrared light remote charging includes the following steps:
[0026] 1) Nano-imprinting is used to fabricate a micron-level circular hole array structure on the pyroelectric film to obtain a structured pyroelectric film. The pyroelectric film is a PVDF film with a thickness of 100 μm. The hole array has a hole diameter of 70 μm. The pitch is 120μm and the hole depth is 50μm;
[0027] 2) Reference figure 1 (a) Sputter a metal film 2 with a thickness of 10nm on one end of the upper and lower sides of the structured PVDF film 1. The material of the metal film 2 is Au; figure 1 (b) The transparent electrode film 3 is prepared by wet transfer on one end of the upper and lower sides of the structured PVDF film 1, so that one side of the transparent electrode film 3 is placed on the metal film 2. The material of the transparent electrode film 3 is graphene; figure 1 (c) Fix the copper wire 4 on the metal film 2...
Embodiment 2
[0032] A method for manufacturing a flexible implantable power supply based on infrared light remote charging includes the following steps:
[0033] 1) The micron-level square hole array structure is fabricated on the pyroelectric film by wet etching to obtain a structured pyroelectric film. The pyroelectric film is a PVDF film with a thickness of 30 μm, and the hole width of the square hole array is 50 μm. The hole spacing is 100μm, and the hole depth is 10μm;
[0034] 2) Reference figure 1 (a) Sputter a metal film 2 with a thickness of 20nm on one end of the upper and lower sides of the structured PVDF film 1. The material of the metal film 2 is Ag; figure 1 (b) Use the spin coating method to prepare transparent electrode films 3 on the upper and lower sides of the structured PVDF film 1, so that one side of the transparent electrode film 3 is placed on the metal film 2. The material of the transparent electrode film 3 is PEDOT; figure 1 (c) Fix the copper wire 4 on the metal film...
Embodiment 3
[0039] A method for manufacturing a flexible implantable power supply based on infrared light remote charging includes the following steps:
[0040] 1) Using dry etching to fabricate a micron-level groove array structure on the pyroelectric film to obtain a structured pyroelectric film. The pyroelectric film is a PMN-PT film with a thickness of 50μm. The groove width of the through-slot array is 100μm, the groove pitch is 150μm, and the groove depth is 20μm;
[0041] 2) Reference figure 1 (a) Sputter a metal film 2 with a thickness of 50nm on one end of the upper and lower sides of the structured PMN-PT film 1. The material of the metal film 2 is Cu; figure 1 (b) Prepare the transparent electrode film 3 on the upper and lower sides of the structured PMN-PT film 1 by magnetron sputtering, so that one side of the transparent electrode film 3 is placed on the metal film 2. The material of the transparent electrode film 3 is ITO ; Reference figure 1 (c) Fix the copper wire 4 on the met...
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