Manufacturing method of flexible implantable power supply based on infrared light remote charging
A manufacturing method and implantable technology, applied in the field of medical electronics, can solve the problems of limited energy transmission distance, unstable energy conversion method, complex environment, etc., achieve high infrared penetration, and improve light-thermal-electric conversion efficiency. , the effect of increasing the specific surface area
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Embodiment 1
[0025] A method for manufacturing a flexible implantable power supply based on infrared light remote charging, comprising the following steps:
[0026] 1) Fabricate a micron-scale circular hole array structure on the pyroelectric film by nanoimprinting to obtain a structured pyroelectric film. The pyroelectric film is a PVDF film with a thickness of 100 μm, and the diameter of the circular hole array is 70 μm. The spacing is 120μm, and the hole depth is 50μm;
[0027] 2) Refer to figure 1 (a), sputtering a layer of metal film 2 with a thickness of 10nm at one end of the upper and lower sides of the structured PVDF film 1, the material of the metal film 2 is Au; refer to figure 1 (b), using wet transfer to prepare a transparent electrode film 3 at one end of the upper and lower sides of the structured PVDF film 1, so that one side of the transparent electrode film 3 is placed on the metal film 2, and the material of the transparent electrode film 3 is graphene; refer to figur...
Embodiment 2
[0032] A method for manufacturing a flexible implantable power supply based on infrared light remote charging, comprising the following steps:
[0033] 1) Fabricate a micron-scale square hole array structure on the pyroelectric film by wet etching to obtain a structured pyroelectric film. The pyroelectric film is a PVDF film with a thickness of 30 μm, and the pore width of the square hole array is 50 μm. The hole spacing is 100μm, and the hole depth is 10μm;
[0034] 2) Refer to figure 1 (a), sputtering a metal film 2 with a thickness of 20nm at one end of the upper and lower sides of the structured PVDF film 1, the material of the metal film 2 is Ag; refer to figure 1 (b), the transparent electrode film 3 is prepared on the upper and lower sides of the structured PVDF film 1 by spin coating, so that one side of the transparent electrode film 3 is placed on the metal film 2, and the material of the transparent electrode film 3 is PEDOT; refer to figure 1 (c), the copper wire...
Embodiment 3
[0039] A method for manufacturing a flexible implantable power supply based on infrared light remote charging, comprising the following steps:
[0040] 1) A micron-scale groove array structure is fabricated on the pyroelectric film by dry etching to obtain a structured pyroelectric film. The pyroelectric film is a PMN-PT film with a thickness of 50 μm, and the groove width of the through groove array is 100μm, the groove spacing is 150μm, and the groove depth is 20μm;
[0041] 2) Refer to figure 1 (a), one end sputtering thickness is the metal thin film 2 of 50nm at the upper and lower sides of structured PMN-PT thin film 1, and metal thin film 2 material is Cu; Refer to figure 1 (b), adopt magnetron sputtering method to prepare transparent electrode film 3 on the upper and lower sides of structured PMN-PT film 1, make one side of transparent electrode film 3 ride on metal film 2, transparent electrode film 3 materials are ITO ; refer to figure 1 (c), the copper wire 4 is f...
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