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Burn-in board radiating device

A heat dissipation device and burn-in board technology, which is applied to household refrigeration devices, lighting and heating equipment, household appliances, etc., can solve the problems of cumbersome and complicated processes, reduce the service life of burn-in boards, and low labor production efficiency, and achieve high promotion value. High practical value and good maneuverability

Inactive Publication Date: 2016-05-11
BEIJING YUANLIU HONGYUAN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method of labor production efficiency is low, the process is cumbersome and complicated, and it also reduces the service life of the aging board

Method used

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  • Burn-in board radiating device

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Embodiment Construction

[0018] Such as figure 1 As shown, the embodiment of the present invention is a heat dissipation device for burn-in plates, which includes a box support plate 1, two sets of heat dissipation plate support frames 2 are arranged inside, and multiple sets of parallel slideways are arranged on the heat dissipation plate support frames 2. Two sets of parallel fans 3 are installed on the main body of the device, and a protective net 4 is installed outside the fans 3 . A pulley 8 is arranged below the device main body. A control device 6 is installed under the rear part of the device body. The control device 6 includes a protective case, and a circuit board, a power switch, a fan controller, a protection module and an outgoing wire 7 are connected to the power supply inside the protective case. The outer material of the box body 1 is steel plate, and the inner lining is mirror stainless steel. The inner cavity is smooth and clean, and is easy to clean. The connection between the cool...

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Abstract

The invention relates to a burn-in board radiating device which comprises a device main body, wherein the device main body is formed by fixing a plurality of box body supporting plates; two groups of radiating plate supporting frames are arranged on the inner part of the device main body; a plurality of groups of parallel slideways are arranged on the radiating plate supporting frames; burn-in boards are inserted into the parallel slideways; two groups of parallel fans are mounted at the two sides of the device main body; and a control device is mounted under the rear part of the device main body. The burn-in board radiating device has the beneficial effects that: circuits are put in order by mounting the fans and the control device; the fans are used for directly blowing cool breeze to the burn-in boards, so that the burn-in boards are quickly cooled, and therefore, the burn-in board radiating device is stable and safe, is convenient to operate, and is good in maneuverability, and has a higher practical value and a higher popularization value; and the circuits are resistant to a high temperature, and are convenient to store, so that the burn-in board radiating device has the advantages of reducing collision, in a transporting process, to the burn-in boards, prolonging the service lives of the burn-in boards, and the like.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for burn-in boards. Background technique [0002] The aging test device is used in the development and production of capacitors, that is, the capacitors are subjected to reliability tests under certain aging conditions to evaluate the quality of capacitor products. In this process, the capacitor must first be loaded into the fixture of the burn-in board, and then the burn-in board should be put into the burn-in test box for testing. The test is carried out in a high-temperature and high-pressure environment for a long time. After the aging is over, the aging board needs to be taken out of the aging device, and it is aged after heat dissipation, unloading, and re-implantation of capacitors. [0003] The traditional method is to manually remove the aging board from the aging device. Because the temperature of the aging board is relatively...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D1/00F25D29/00
CPCF25D1/00F25D29/005
Inventor 管晓辉陈喆
Owner BEIJING YUANLIU HONGYUAN ELECTRONICS TECH