Secondary-etching double-sided circuit board structure and processing technique thereof

Abstract

The invention discloses a secondary-etching double-sided circuit board structure and a processing technique thereof. The secondary-etching double-sided circuit board structure comprises a GTL line layer, an insulating PP layer and a GBL stepped surface line layer. The GBL stepped surface line layer is formed by a GBL inner line layer and a GBL outer line layer; the insulating PP layer is arranged between the GTL line layer and the GBL inner line layer; and the GBL outer line layer is arranged on the other surface of the GBL inner line layer. In addition, The processing technique consists of a first line manufacturing process and a secondary line manufacturing process; the first line manufacturing process includes steps of first line graph manufacturing, line development cam compensation, line examination, and etching; and the secondary line manufacturing process includes steps of secondary line graph manufacturing, line development cam compensation, line examination, etching, and electric detection on an open circuit and a short circuit, and a post procedure. According to the invention, only two-times manufacturing is carried out; the investment is low; the production flow is simplified and the working difficulty is reduced; the production efficiency is improved; the production cost is lowered; the reject ratio is reduced; and the product production period is reduced.

Description

technical field [0001] The invention relates to a circuit board production process, in particular to a secondary etching double-sided circuit board production process. Background technique [0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. When it comes to management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet the customer's requirements; after the research, the operation can be completed in the second time, and the product quality can also be improved. get regulated. In order to solve the above problems, a new type of superimposed circuit board circuit prod...

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Problems solved by technology

[0002] In the current circuit board production process, double-sided circuit boards with GTL circuit layer, GBL internal circuit layer and GBL external circuit layer are all manufactured three times, and the circuit production is completed one by one. The cumulative error of production is very large, and the product quality is not good. When it comes to management and control, the operation cycle is long, the production cycle is long, the production delivery time cannot be improved, and the cost investment is also large, which cannot meet the customer's requirements; after the research, the operation can be completed in the second time, and the product quality can also be improved. be regulated

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