Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation method for computer host

A heat dissipation method and computer technology, applied in calculation, instrumentation, electrical digital data processing, etc., can solve problems affecting the use and life of equipment, and achieve the effect of facilitating heat dissipation, strengthening heat dissipation effect, and reducing obstruction

Inactive Publication Date: 2016-05-18
CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing heat dissipation methods for computer hosts, especially when used as servers, have a serious problem of heat dissipation due to continuous work for a long time, thereby affecting the life of the equipment. Therefore, it is necessary to design a new heat dissipation method for computer hosts

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation method for computer host
  • Heat dissipation method for computer host

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] like Figure 1-2 , a heat dissipation method of a computer mainframe, the chassis of the mainframe of the computer adopts a double-layer chassis structure for heat dissipation, and the chassis includes an outer box 1 and an inner box 2 arranged in the outer box; a main board 5 and a memory array are arranged in the inner box; The memory array is composed of 4 hard disks 3;

[0023] The main board and hard disk are arranged parallel to the bottom surface of the inner box; the hard disk is located above the main board;

[0024] The inner box is also provided with a plurality of water-cooled tubes 4 arranged in parallel; the water-cooled tubes are used to provide heat dissipation for the equipment in the inner box;

[0025] The water cooling tube is located in the interval between the motherboard and the hard disk, or in the interval between the hard disk and the hard disk;

[0026] The 4 hard drives are located above the motherboard in 2 layers, and the water-cooling tu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat dissipation method for a computer host. Heat of a chassis of the computer host is dissipated by adopting a double-layer chassis structure; the chassis comprises an outer box (1) and an inner box (2) arranged in the outer box; a mainboard (5) and a memory array are arranged in the inner box; the memory array is composed of a plurality of hard disks (3); the mainboard and the hard disks are arranged to be parallel to the bottom of the inner box; the hard disks are positioned over the mainboard; a plurality of parallel water cooling tubes (4) are also arranged in the inner box; heat of equipment in the inner box is dissipated by adopting the water cooling tubes; and the water cooling tubes are positioned in the clearance of the mainboard and the hard disks or positioned in the clearance of the hard disks. According to the heat dissipation method for the computer host, joint heat dissipation in wind-cooling and water-cooling manners is adopted; the heat dissipation effect is good; and the heat dissipation method is easy to implement.

Description

technical field [0001] The invention particularly relates to a cooling method for a computer mainframe. Background technique [0002] Existing heat dissipation methods for computer hosts, especially when used as servers, have serious heat dissipation problems due to long-term continuous work, thereby affecting the life of the equipment. Therefore, it is necessary to design a new heat dissipation method for computer hosts. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a heat dissipation method for a computer mainframe, which adopts a water cooling method to dissipate heat, has good heat dissipation effect and is easy to implement. [0004] The technical solution of the invention is as follows: [0005] A heat dissipation method for a computer mainframe. The chassis of the mainframe of the computer adopts a double-layer chassis structure for heat dissipation. The chassis includes an outer box 1 and an inner box ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 贺超英
Owner CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com